Fengsheng XI

Person

Ningbo, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Camera module, molded photosensitive assembly and manufacturing met...
- Patent number 11,906,879
- Issue date Feb 20, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhen Huang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Array imaging module and molded photosensitive assembly and manufac...
- Patent number 11,822,099
- Issue date Nov 21, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive component, and camera module and manufacturing metho...
- Patent number 11,729,483
- Issue date Aug 15, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photosensitive assembly and camera module and manufacturing method...
- Patent number 11,627,239
- Issue date Apr 11, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module and molding circuit board assembly, circuit board and...
- Patent number 11,451,693
- Issue date Sep 20, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photosensitive component, and camera module and manufacturing metho...
- Patent number 11,388,320
- Issue date Jul 12, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photosensitive assembly and camera module and manufacturing method...
- Patent number 11,223,751
- Issue date Jan 11, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module and molding circuit board assembly, circuit board and...
- Patent number 11,039,052
- Issue date Jun 15, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Molded photosensitive assembly of array imaging module
- Patent number 10,908,324
- Issue date Feb 2, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Molded photosensitive assembly for array imaging module for electro...
- Patent number 10,578,837
- Issue date Mar 3, 2020
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive assembly and camera module and manufacturing method...
- Patent number 10,582,097
- Issue date Mar 3, 2020
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photosensitive assembly and camera module and manufacturing method...
- Patent number 10,321,028
- Issue date Jun 11, 2019
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Manufacturing method of a molded photosensitive assembly of an arra...
- Patent number 10,274,694
- Issue date Apr 30, 2019
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Array imaging module and molded photosensitive assembly and manufac...
- Patent number 10,175,447
- Issue date Jan 8, 2019
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Array imaging module and molded photosensitive assembly and manufac...
- Patent number 10,148,859
- Issue date Dec 4, 2018
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array imaging module and molded photosensitive assembly and manufac...
- Patent number 10,126,519
- Issue date Nov 13, 2018
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array imaging module and molded photosensitive assembly and manufac...
- Patent number 10,033,913
- Issue date Jul 24, 2018
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Array imaging module and molded photosensitive assembly and manufac...
- Patent number 9,906,700
- Issue date Feb 27, 2018
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Array imaging module and molded photosensitive assembly and manufac...
- Patent number 9,826,132
- Issue date Nov 21, 2017
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Array imaging module and molded photosensitive assembly and manufac...
- Patent number 9,781,325
- Issue date Oct 3, 2017
- NingBo Sunny Opotech Co., Ltd.
- Mingzhu Wang
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD ASSEMBLY, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE, AND...
- Publication number 20220367556
- Publication date Nov 17, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE COMPONENT, AND CAMERA MODULE AND MANUFACTURING METHO...
- Publication number 20220303437
- Publication date Sep 22, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOLDED PHOTOSENSITIVE ASSEMBLY FOR ARRAY IMAGING MODULE FOR ELECTRO...
- Publication number 20220268968
- Publication date Aug 25, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE, MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING MET...
- Publication number 20220179288
- Publication date Jun 9, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhen HUANG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PHOTOSENSITIVE ASSEMBLY AND CAMERA MODULE AND MANUFACTURING METHOD...
- Publication number 20220094822
- Publication date Mar 24, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Photosensitive Component, And Camera Module And Manufacturing Metho...
- Publication number 20210306530
- Publication date Sep 30, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE AND MOLDING CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND...
- Publication number 20210266436
- Publication date Aug 26, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Photosensitive Assembly and Camera Module and Manufacturing Method...
- Publication number 20210127040
- Publication date Apr 29, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20210088696
- Publication date Mar 25, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE AND MOLDING CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND...
- Publication number 20200244852
- Publication date Jul 30, 2020
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Molded Photosensitive Assembly for Array Imaging Module for Electro...
- Publication number 20200218034
- Publication date Jul 9, 2020
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photosensitive Assembly and Camera Module and Manufacturing Method...
- Publication number 20190253585
- Publication date Aug 15, 2019
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20190179099
- Publication date Jun 13, 2019
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...
- Publication number 20190041727
- Publication date Feb 7, 2019
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20180288296
- Publication date Oct 4, 2018
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20180164529
- Publication date Jun 14, 2018
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20180020138
- Publication date Jan 18, 2018
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20180009141
- Publication date Jan 11, 2018
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20180012923
- Publication date Jan 11, 2018
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photosensitive Assembly and Camera Module and Manufacturing Method...
- Publication number 20180007244
- Publication date Jan 4, 2018
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20170264801
- Publication date Sep 14, 2017
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20170264802
- Publication date Sep 14, 2017
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20170264804
- Publication date Sep 14, 2017
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Array Imaging Module and Molded Photosensitive Assembly and Manufac...
- Publication number 20170264803
- Publication date Sep 14, 2017
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- G02 - OPTICS

Fengsheng XI

Person

Patents Grantslast 30 patents

Camera module, molded photosensitive assembly and manufacturing met...

Array imaging module and molded photosensitive assembly and manufac...

Photosensitive component, and camera module and manufacturing metho...

Photosensitive assembly and camera module and manufacturing method...

Camera module and molding circuit board assembly, circuit board and...

Photosensitive component, and camera module and manufacturing metho...

Photosensitive assembly and camera module and manufacturing method...

Camera module and molding circuit board assembly, circuit board and...

Molded photosensitive assembly of array imaging module

Molded photosensitive assembly for array imaging module for electro...

Photosensitive assembly and camera module and manufacturing method...

Photosensitive assembly and camera module and manufacturing method...

Manufacturing method of a molded photosensitive assembly of an arra...

Array imaging module and molded photosensitive assembly and manufac...

Array imaging module and molded photosensitive assembly and manufac...

Array imaging module and molded photosensitive assembly and manufac...

Array imaging module and molded photosensitive assembly and manufac...

Array imaging module and molded photosensitive assembly and manufac...

Array imaging module and molded photosensitive assembly and manufac...

Array imaging module and molded photosensitive assembly and manufac...

Patents Applicationslast 30 patents

CIRCUIT BOARD ASSEMBLY, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE, AND...

PHOTOSENSITIVE COMPONENT, AND CAMERA MODULE AND MANUFACTURING METHO...

MOLDED PHOTOSENSITIVE ASSEMBLY FOR ARRAY IMAGING MODULE FOR ELECTRO...

CAMERA MODULE, MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING MET...

PHOTOSENSITIVE ASSEMBLY AND CAMERA MODULE AND MANUFACTURING METHOD...

Photosensitive Component, And Camera Module And Manufacturing Metho...

CAMERA MODULE AND MOLDING CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND...

Photosensitive Assembly and Camera Module and Manufacturing Method...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

CAMERA MODULE AND MOLDING CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND...

Molded Photosensitive Assembly for Array Imaging Module for Electro...

Photosensitive Assembly and Camera Module and Manufacturing Method...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

Array Imaging Module and Molded Photosensitive Assembly, Circuit Bo...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

Photosensitive Assembly and Camera Module and Manufacturing Method...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...

Array Imaging Module and Molded Photosensitive Assembly and Manufac...