Fengwei Dai

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Wuxi, CN

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Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...
- Publication number 20230091513
- Publication date Mar 23, 2023
- SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Front-top Interconnection Process
- Publication number 20140370703
- Publication date Dec 18, 2014
- Fengwei Dai
- H01 - BASIC ELECTRIC ELEMENTS