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Ferdinand Aldas
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San Pedro, PH
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last 30 patents
Information
Patent Grant
Semiconductor device processing method for material removal
Patent number
10,600,652
Issue date
Mar 24, 2020
Deca Technologies Inc.
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device processing method for material removal
Patent number
9,640,495
Issue date
May 2, 2017
Deca Technologies Inc.
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetically sealed wafer plating jig system and method
Patent number
9,464,362
Issue date
Oct 11, 2016
Deca Technologies Inc.
Christopher M. Scanlan
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL
Publication number
20170221719
Publication date
Aug 3, 2017
DECA TECHNOLOGIES INC
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL
Publication number
20170012009
Publication date
Jan 12, 2017
DECA TECHNOLOGIES INC
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETICALLY SEALED WAFER PLATING JIG SYSTEM AND METHOD
Publication number
20140024178
Publication date
Jan 23, 2014
Christopher M. Scanlan
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR