Ferdinand F. Fernandez

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for thermal interface material (TIM) bond lin...
- Patent number 10,529,645
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having an enhanced lid
- Patent number 10,043,730
- Issue date Aug 7, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTECTION APPARATUS FOR A PHOTONIC DEVICE
- Publication number 20240329329
- Publication date Oct 3, 2024
- Xilinx, Inc.
- Gamal REFAI-AHMED
- G02 - OPTICS
Information Patent Application
METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...
- Publication number 20180358280
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING AN ENHANCED LID
- Publication number 20170092619
- Publication date Mar 30, 2017
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS