Feroz Mohammad

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual-sided socket device with corrugation structures and shield str...
- Patent number 12,009,612
- Issue date Jun 11, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided socket device with corrugation structures
- Patent number 11,916,322
- Issue date Feb 27, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heated pins to couple with solder elements
- Patent number 11,830,846
- Issue date Nov 28, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket load regulation utilizing CPU carriers with shim components
- Patent number 11,818,832
- Issue date Nov 14, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure features to alter the shape of a socket
- Patent number 11,569,596
- Issue date Jan 31, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin through solder interconnect and methods
- Patent number 10,505,297
- Issue date Dec 10, 2019
- Intel Corporation
- Feroz Mohammad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin through solder interconnect and methods
- Patent number 10,355,380
- Issue date Jul 16, 2019
- Intel Corporation
- Feroz Mohammad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal linear edge connector
- Patent number 10,044,115
- Issue date Aug 7, 2018
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICRO SOCKET ELECTRICAL COUPLINGS FOR DIES
- Publication number 20220200183
- Publication date Jun 23, 2022
- Intel Corporation
- Srikant NEKKANTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES
- Publication number 20220102883
- Publication date Mar 31, 2022
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...
- Publication number 20220102892
- Publication date Mar 31, 2022
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SOCKET PIN FOR SELF-RETENTION TO A CONDUCTIVE INTERPOSER
- Publication number 20220069532
- Publication date Mar 3, 2022
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET
- Publication number 20210305731
- Publication date Sep 30, 2021
- Intel Corporation
- Steven A. KLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS
- Publication number 20210307153
- Publication date Sep 30, 2021
- Intel Corporation
- Feroz MOHAMMAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATED PINS TO COUPLE WITH SOLDER ELEMENTS
- Publication number 20200381388
- Publication date Dec 3, 2020
- Intel Corporation
- Feroz MOHAMMAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN THROUGH SOLDER INTERCONNECT AND METHODS
- Publication number 20190305451
- Publication date Oct 3, 2019
- Intel Corporation
- Feroz Mohammad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Universal linear edge connector
- Publication number 20170187147
- Publication date Jun 29, 2017
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS

Feroz Mohammad

Person

Patents Grantslast 30 patents

Dual-sided socket device with corrugation structures and shield str...

Dual-sided socket device with corrugation structures

Heated pins to couple with solder elements

Socket load regulation utilizing CPU carriers with shim components

Pressure features to alter the shape of a socket

Pin through solder interconnect and methods

Pin through solder interconnect and methods

Universal linear edge connector

Patents Applicationslast 30 patents

MICRO SOCKET ELECTRICAL COUPLINGS FOR DIES

DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES

DUAL-SIDED SOCKET DEVICE WITH CORRUGATION STRUCTURES AND SHIELD STR...

ELECTRONIC SOCKET PIN FOR SELF-RETENTION TO A CONDUCTIVE INTERPOSER

PRESSURE FEATURES TO ALTER THE SHAPE OF A SOCKET

SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS

HEATED PINS TO COUPLE WITH SOLDER ELEMENTS

PIN THROUGH SOLDER INTERCONNECT AND METHODS

Universal linear edge connector