Fion Tan

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic connection components having bondable wires
- Patent number 7,268,304
- Issue date Sep 11, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Microelectronic connection components having bondable wires
- Publication number 20050243529
- Publication date Nov 3, 2005
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS