TREA

FLAVIO GRIGGIO

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  • Portland, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Cladded metal interconnects
    • Patent number 11,749,560
    • Issue date Sep 5, 2023
    • Intel Corporation
    • Thomas Marieb
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Methods of forming substrate interconnect structures for enhanced t...
    • Patent number 11,652,067
    • Issue date May 16, 2023
    • Intel Corporation
    • Christopher J. Jezewski
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Copper interconnect cladding
    • Patent number 11,270,943
    • Issue date Mar 8, 2022
    • Intel Corporation
    • Flavio Griggio
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Use of noble metals in the formation of conductive connectors
    • Patent number 11,094,587
    • Issue date Aug 17, 2021
    • Intel Corporation
    • Christopher J. Jezewski
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Integrated circuit interconnects
    • Patent number 11,018,054
    • Issue date May 25, 2021
    • Intel Corporation
    • Daniel J. Zierath
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Decoupled via fill
    • Patent number 10,903,114
    • Issue date Jan 26, 2021
    • Intel Corporation
    • Yuriy V. Shusterman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Decoupled via fill
    • Patent number 10,468,298
    • Issue date Nov 5, 2019
    • Intel Corporation
    • Yuriy V. Shusterman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Decoupled via fill
    • Patent number 10,211,098
    • Issue date Feb 19, 2019
    • Intel Corporation
    • Yuriy V. Shusterman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Decoupled via fill
    • Patent number 10,026,649
    • Issue date Jul 17, 2018
    • Intel Corporation
    • Yuriy V. Shusterman
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    COPPER INTERCONNECT CLADDING
    • Publication number 20220157735
    • Publication date May 19, 2022
    • Intel Corporation
    • Flavio Griggio
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS OF FORMING SUBSTRATE INTERCONNECT STRUCTURES FOR ENHANCED T...
    • Publication number 20200402921
    • Publication date Dec 24, 2020
    • Intel Corporation
    • Christopher J. Jezewski
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLADDED METAL INTERCONNECTS
    • Publication number 20200098619
    • Publication date Mar 26, 2020
    • Intel Corporation
    • Thomas Marieb
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    DECOUPLED VIA FILL
    • Publication number 20200090992
    • Publication date Mar 19, 2020
    • Intel Corporation
    • YURIY V. SHUSTERMAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT INTERCONNECTS
    • Publication number 20200013673
    • Publication date Jan 9, 2020
    • Intel Corporation
    • Daniel J. Zierath
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER INTERCONNECT CLADDING
    • Publication number 20190304918
    • Publication date Oct 3, 2019
    • Intel Corporation
    • Flavio Griggio
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DECOUPLED VIA FILL
    • Publication number 20190221478
    • Publication date Jul 18, 2019
    • Intel Corporation
    • YURIY V. SHUSTERMAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DECOUPLED VIA FILL
    • Publication number 20180350672
    • Publication date Dec 6, 2018
    • Intel Corporation
    • YURIY V. SHUSTERMAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THE USE OF NOBLE METALS IN THE FORMATION OF CONDUCTIVE CONNECTORS
    • Publication number 20180151423
    • Publication date May 31, 2018
    • Christopher J. Jezewski
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BOTTOM-UP FILL (BUF) OF METAL FEATURES FOR SEMICONDUCTOR STRUCTURES
    • Publication number 20180130707
    • Publication date May 10, 2018
    • Intel Corporation
    • Scott B. CLENDENNING
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DECOUPLED VIA FILL
    • Publication number 20170338148
    • Publication date Nov 23, 2017
    • Intel Corporation
    • YURIY V. SHUSTERMAN
    • H01 - BASIC ELECTRIC ELEMENTS