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Florence R. Pon
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Folsom, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Die over mold stacked semiconductor package
Patent number
11,948,917
Issue date
Apr 2, 2024
Intel Corporation
Florence Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Choked flow cooling
Patent number
11,901,264
Issue date
Feb 13, 2024
SK hynix NAND Product Solutions Corp.
Mark Forsnes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit device with recess structure
Patent number
11,901,274
Issue date
Feb 13, 2024
Intel Corporation
Bin Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die, vertical-wire package-in-package apparatus, and methods...
Patent number
11,749,653
Issue date
Sep 5, 2023
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Computer-assisted or autonomous driving vehicles social network
Patent number
11,704,007
Issue date
Jul 18, 2023
Intel Corporation
Fatema Adenwala
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Temporary interconnect for use in testing a semiconductor package
Patent number
11,658,079
Issue date
May 23, 2023
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shrinkable package assembly
Patent number
11,652,031
Issue date
May 16, 2023
Intel Corporation
Florence Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Edge devices utilizing personalized machine learning and methods of...
Patent number
11,599,750
Issue date
Mar 7, 2023
Intel Corporation
Maruti Gupta Hyde
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
Patent number
11,562,978
Issue date
Jan 24, 2023
Intel Corporation
Florence R. Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package
Patent number
11,552,051
Issue date
Jan 10, 2023
Intel Corporation
Florence R. Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diode for use in testing semiconductor packages
Patent number
11,545,464
Issue date
Jan 3, 2023
Intel Corporation
Yi Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fiber reinforced stiffener
Patent number
11,495,547
Issue date
Nov 8, 2022
Intel Corporation
Florence Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and method of forming an electronic package
Patent number
11,399,434
Issue date
Jul 26, 2022
Intel Corporation
Florence Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stack with cascade and vertical connections
Patent number
11,171,114
Issue date
Nov 9, 2021
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Buried electrical debug access port
Patent number
11,064,612
Issue date
Jul 13, 2021
Intel Corporation
Florence R. Pon
G01 - MEASURING TESTING
Information
Patent Grant
Computer-assisted or autonomous driving vehicles social network
Patent number
11,036,370
Issue date
Jun 15, 2021
Intel Corporation
Fatema Adenwala
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Post-grind die backside power delivery
Patent number
10,910,301
Issue date
Feb 2, 2021
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with thermal fins
Patent number
10,573,575
Issue date
Feb 25, 2020
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Post-grind die backside power delivery
Patent number
10,483,198
Issue date
Nov 19, 2019
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D package having edge-aligned die stack with direct inter-die wire...
Patent number
10,332,899
Issue date
Jun 25, 2019
Intel Corporation
Yi Xu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Microelectronic package debug access ports and methods of fabricati...
Patent number
10,090,261
Issue date
Oct 2, 2018
Intel Corporation
Florence R. Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Post-grind die backside power delivery
Patent number
10,032,707
Issue date
Jul 24, 2018
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D chip assemblies using stacked leadframes
Patent number
9,917,041
Issue date
Mar 13, 2018
Intel Corporation
Cory A. Runyan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package debug access ports
Patent number
9,646,952
Issue date
May 9, 2017
Intel Corporation
Florence R. Pon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHOKED FLOW COOLING
Publication number
20240170368
Publication date
May 23, 2024
SK hynix NAND Product Solutions Corp.
Mark Forsnes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPUTER-ASSISTED OR AUTONOMOUS DRIVING VEHICLES SOCIAL NETWORK
Publication number
20230359336
Publication date
Nov 9, 2023
Intel Corporation
Fatema Adenwala
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
Publication number
20220037291
Publication date
Feb 3, 2022
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPUTER-ASSISTED OR AUTONOMOUS DRIVING VEHICLES SOCIAL NETWORK
Publication number
20210303137
Publication date
Sep 30, 2021
Intel Corporation
Fatema Adenwala
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
BURIED ELECTRICAL DEBUG ACCESS PORT
Publication number
20210298183
Publication date
Sep 23, 2021
Intel Corporation
Florence R. PON
G01 - MEASURING TESTING
Information
Patent Application
MULTI-DIE, VERTICAL-WIRE PACKAGE-IN-PACKAGE APPARATUS, AND METHODS...
Publication number
20210288034
Publication date
Sep 16, 2021
Intel Corporation
Hyoung IL Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE OVER MOLD STACKED SEMICONDUCTOR PACKAGE
Publication number
20200343221
Publication date
Oct 29, 2020
Intel Corporation
Florence PON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER WITH STEP FEATURE
Publication number
20200312769
Publication date
Oct 1, 2020
Intel Corporation
Florence PON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NEEDLE DISPENSER FOR DISPENSING AND COLLECTING AN UNDERFILL ENCAPSU...
Publication number
20200294827
Publication date
Sep 17, 2020
Intel Corporation
Florence PON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEMPORARY INTERCONNECT FOR USE IN TESTING A SEMICONDUCTOR PACKAGE
Publication number
20200235018
Publication date
Jul 23, 2020
Intel Corporation
Hyoung Il KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIODE FOR USE IN TESTING SEMICONDUCTOR PACKAGES
Publication number
20200212009
Publication date
Jul 2, 2020
Intel Corporation
Yi XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHRINKABLE PACKAGE ASSEMBLY
Publication number
20200194344
Publication date
Jun 18, 2020
Intel Corporation
Florence PON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHOKED FLOW COOLING
Publication number
20200135616
Publication date
Apr 30, 2020
Intel Corporation
Mark FORSNES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTOR END ASSEMBLIES
Publication number
20200120800
Publication date
Apr 16, 2020
Intel Corporation
Florence PON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FIBER REINFORCED STIFFENER
Publication number
20200118941
Publication date
Apr 16, 2020
Intel Corporation
Florence PON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE WITH RECESS STRUCTURE
Publication number
20200066621
Publication date
Feb 27, 2020
Intel Corporation
Bin LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POST-GRIND DIE BACKSIDE POWER DELIVERY
Publication number
20200051903
Publication date
Feb 13, 2020
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE
Publication number
20200013756
Publication date
Jan 9, 2020
Intel Corporation
Florence R. Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-POINT STACKED DIE WIREBONDING FOR IMPROVED POWER DELIVERY
Publication number
20190326249
Publication date
Oct 24, 2019
Intel Corporation
John G. Meyers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DECOUPLING CAPACITOR MOUNTED ON AN INTEGRATED CIRCUIT DIE, AND METH...
Publication number
20190312005
Publication date
Oct 10, 2019
Intel Corporation
Florence R. Pon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICE STACK HAVING A GROUND SHIELDING LAYER
Publication number
20190279954
Publication date
Sep 12, 2019
Intel Corporation
Min-Tih Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D PACKAGE HAVING EDGE-ALIGNED DIE STACK WITH DIRECT INTER-DIE WIRE...
Publication number
20190103409
Publication date
Apr 4, 2019
Intel Corporation
Yi XU
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
COMPUTER-ASSISTED OR AUTONOMOUS DRIVING VEHICLES SOCIAL NETWORK
Publication number
20190079659
Publication date
Mar 14, 2019
Intel Corporation
Fatema Adenwala
G05 - CONTROLLING REGULATING
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL FINS
Publication number
20190067156
Publication date
Feb 28, 2019
Intel Corporation
Hyoung Il Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BLOCKCHAIN-BASED DIGITAL DATA EXCHANGE
Publication number
20190050854
Publication date
Feb 14, 2019
Intel Corporation
Xue Yang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
MODULAR CONFIGURABLE PLATFORM ARCHITECTURE FOR CA/AD VEHICLES
Publication number
20190047462
Publication date
Feb 14, 2019
Intel Corporation
Divya Vijayaraghavan
G05 - CONTROLLING REGULATING
Information
Patent Application
EDGE DEVICES UTILIZING PERSONALIZED MACHINE LEARNING AND METHODS OF...
Publication number
20190050683
Publication date
Feb 14, 2019
Intel Corporation
Maruti Gupta Hyde
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
Publication number
20180366441
Publication date
Dec 20, 2018
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POST-GRIND DIE BACKSIDE POWER DELIVERY
Publication number
20180315699
Publication date
Nov 1, 2018
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POST-GRIND DIE BACKSIDE POWER DELIVERY
Publication number
20180182699
Publication date
Jun 28, 2018
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS