Florian Bieck

Person

Mainz, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing electronic components
- Patent number 8,114,304
- Issue date Feb 14, 2012
- Wafer-Level Packaging Portfolio LLC
- Jürgen Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the production of structured layers on substrates
- Patent number 7,825,029
- Issue date Nov 2, 2010
- Schott AG
- Jurgen Leib
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for making contact with and housing integrated circuits
- Patent number 7,821,106
- Issue date Oct 26, 2010
- Schott AG
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making contact with and housing integrated circuits
- Patent number 7,700,957
- Issue date Apr 20, 2010
- Schott AG
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing microelectromechanical components and a house...
- Patent number 7,285,834
- Issue date Oct 23, 2007
- Schott AG
- Jürgen Leib
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing electronic componets
- Patent number 7,160,478
- Issue date Jan 9, 2007
- Schott AG
- Jürgen Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing microelectromechanical components and a house...
- Patent number 7,071,521
- Issue date Jul 4, 2006
- Schott AG
- Jürgen Leib
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for making contact with and housing integrated circuits
- Patent number 6,911,392
- Issue date Jun 28, 2005
- Schott Glas
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing microelectromechanical components and a house...
- Patent number 6,894,358
- Issue date May 17, 2005
- Schott Glas
- Jūrgen Leib
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Process for Making Contact with and Housing Integrated Circuits
- Publication number 20130137259
- Publication date May 30, 2013
- WAFER-LEVEL PACKAGING PORTFOLIO LLC
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS
- Publication number 20080150063
- Publication date Jun 26, 2008
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing electronic components
- Publication number 20070063202
- Publication date Mar 22, 2007
- Jurgen Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing microelectromechanical components and a house...
- Publication number 20060160258
- Publication date Jul 20, 2006
- Jurgen Leib
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process for producing a product having a structured surface
- Publication number 20060051584
- Publication date Mar 9, 2006
- Florian Bieck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for the production of structured layers on substrates
- Publication number 20050233503
- Publication date Oct 20, 2005
- Jurgen Leib
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process for producing microelectromechanical components and a house...
- Publication number 20050064644
- Publication date Mar 24, 2005
- Jurgen Leib
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process for making contact with and housing integrated circuits
- Publication number 20050042786
- Publication date Feb 24, 2005
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing electronic componets
- Publication number 20040256349
- Publication date Dec 23, 2004
- Jurgen Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for making contact with and housing integrated circuits
- Publication number 20030113979
- Publication date Jun 19, 2003
- Florian Bieck
- H01 - BASIC ELECTRIC ELEMENTS

Florian Bieck

Person

Patents Grantslast 30 patents

Method for producing electronic components

Method for the production of structured layers on substrates

Process for making contact with and housing integrated circuits

Process for making contact with and housing integrated circuits

Process for producing microelectromechanical components and a house...

Method for producing electronic componets

Process for producing microelectromechanical components and a house...

Process for making contact with and housing integrated circuits

Process for producing microelectromechanical components and a house...

Patents Applicationslast 30 patents

Process for Making Contact with and Housing Integrated Circuits

PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS

Method for producing electronic components

Process for producing microelectromechanical components and a house...

Process for producing a product having a structured surface

Method for the production of structured layers on substrates

Process for producing microelectromechanical components and a house...

Process for making contact with and housing integrated circuits

Method for producing electronic componets

Process for making contact with and housing integrated circuits