Florian Binder

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Gauting-Buchendorf, DE

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit having a semiconductor substrate with barrier layer
- Patent number 8,581,405
- Issue date Nov 12, 2013
- Infineon Technologies AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate with feedthrough and method for producing the same
- Patent number 8,263,491
- Issue date Sep 11, 2012
- Infineon Technologies AG
- Florian Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with feedthrough and method for producing the same
- Patent number 8,048,801
- Issue date Nov 1, 2011
- Infineon Technologies, AG
- Stephan Dertinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a semiconductor substrate with a barrier...
- Patent number 7,977,798
- Issue date Jul 12, 2011
- Infineon Technologies AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip carrier with reduced interference signal sensitivity
- Patent number 7,911,026
- Issue date Mar 22, 2011
- Qimonda AG
- Florian Binder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SUBSTRATE WITH BARRIER LAYER
- Publication number 20110233630
- Publication date Sep 29, 2011
- INFINEON TECHNOLOGIES AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SUBSTRATE WITH A BARRIER...
- Publication number 20090026616
- Publication date Jan 29, 2009
- INFINEON TECHNOLOGIES AG
- Stephan Dertinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip carrier substrate and production method therefor
- Publication number 20080308303
- Publication date Dec 18, 2008
- Volker Lehmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with Feedthrough and Method for Producing the Same
- Publication number 20080268638
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Stephan Dertinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH FEEDTHROUGH AND METHOD FOR PRODUCING THE SAME
- Publication number 20080217784
- Publication date Sep 11, 2008
- Florian Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER WITH REDUCED INTERFERENCE SIGNAL SENSITIVITY
- Publication number 20070210417
- Publication date Sep 13, 2007
- QIMONDA AG
- Florian Binder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR