Florian BRANDL

Person

Wolnzach, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Integration of stress decoupling and particle filter on a single wa...
- Patent number 11,505,450
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Segmented stress decoupling via frontside trenching
- Patent number 11,247,895
- Issue date Feb 15, 2022
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensors and method for forming a MEMS pressure sensor
- Patent number 10,996,125
- Issue date May 4, 2021
- Infineon Technologies AG
- Markus Eckinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration of stress decoupling and particle filter on a single wa...
- Patent number 10,899,604
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,858,245
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mechanical stress decoupling for microelectromechanical systems (ME...
- Patent number 10,843,916
- Issue date Nov 24, 2020
- Infineon Technologies AG
- Dirk Meinhold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Segmented stress decoupling via frontside trenching
- Patent number 10,807,862
- Issue date Oct 20, 2020
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,370,244
- Issue date Aug 6, 2019
- Infineon Technologies AG
- Florian Brandl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SENSOR FOR PARALLEL MEASUREMENT OF PRESSURE AND ACCELERATION AND US...
- Publication number 20230102575
- Publication date Mar 30, 2023
- INFINEON TECHNOLOGIES AG
- Daniel KÖHLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
DIFFERENTIAL GAS SENSOR WITH TWO SENSOR COMPONENTS AND USE FOR DETE...
- Publication number 20230059356
- Publication date Feb 23, 2023
- INFINEON TECHNOLOGIES AG
- Dirk Meinhold
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICES WITH SUPPORT STRUCTURES AND ASSOCIATED PRODUCTION METHODS
- Publication number 20210363001
- Publication date Nov 25, 2021
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSORS AND METHOD FOR FORMING A MEMS PRESSURE SENSOR
- Publication number 20210148776
- Publication date May 20, 2021
- INFINEON TECHNOLOGIES AG
- Markus ECKINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION OF STRESS DECOUPLING AND PARTICLE FILTER ON A SINGLE WA...
- Publication number 20210032097
- Publication date Feb 4, 2021
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEGMENTED STRESS DECOUPLING VIA FRONTSIDE TRENCHING
- Publication number 20200346922
- Publication date Nov 5, 2020
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION OF STRESS DECOUPLING AND PARTICLE FILTER ON A SINGLE WA...
- Publication number 20200331748
- Publication date Oct 22, 2020
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEGMENTED STRESS DECOUPLING VIA FRONTSIDE TRENCHING
- Publication number 20200317508
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MECHANICAL STRESS DECOUPLING FOR MICROELECTROMECHANICAL SYSTEMS (ME...
- Publication number 20200283286
- Publication date Sep 10, 2020
- INFINEON TECHNOLOGIES AG
- Dirk MEINHOLD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...
- Publication number 20190300362
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...
- Publication number 20190161345
- Publication date May 30, 2019
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSORS AND METHOD FOR FORMING A MEMS PRESSURE SENSOR
- Publication number 20180335359
- Publication date Nov 22, 2018
- INFINEON TECHNOLOGIES AG
- Markus ECKINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Florian BRANDL

Person

Patents Grantslast 30 patents

Integration of stress decoupling and particle filter on a single wa...

Segmented stress decoupling via frontside trenching

Pressure sensors and method for forming a MEMS pressure sensor

Integration of stress decoupling and particle filter on a single wa...

Deposition of protective material at wafer level in front end for e...

Mechanical stress decoupling for microelectromechanical systems (ME...

Segmented stress decoupling via frontside trenching

Deposition of protective material at wafer level in front end for e...

Patents Applicationslast 30 patents

SENSOR FOR PARALLEL MEASUREMENT OF PRESSURE AND ACCELERATION AND US...

DIFFERENTIAL GAS SENSOR WITH TWO SENSOR COMPONENTS AND USE FOR DETE...

MEMS DEVICES WITH SUPPORT STRUCTURES AND ASSOCIATED PRODUCTION METHODS

PRESSURE SENSORS AND METHOD FOR FORMING A MEMS PRESSURE SENSOR

INTEGRATION OF STRESS DECOUPLING AND PARTICLE FILTER ON A SINGLE WA...

SEGMENTED STRESS DECOUPLING VIA FRONTSIDE TRENCHING

INTEGRATION OF STRESS DECOUPLING AND PARTICLE FILTER ON A SINGLE WA...

SEGMENTED STRESS DECOUPLING VIA FRONTSIDE TRENCHING

MECHANICAL STRESS DECOUPLING FOR MICROELECTROMECHANICAL SYSTEMS (ME...

DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...

DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...

PRESSURE SENSORS AND METHOD FOR FORMING A MEMS PRESSURE SENSOR