Florian Kurz

Person

Taufkirchen an der Pram, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,862,487
- Issue date Jan 2, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,697,281
- Issue date Jul 11, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,562,912
- Issue date Jan 24, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,527,410
- Issue date Dec 13, 2022
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,276,589
- Issue date Mar 15, 2022
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,251,045
- Issue date Feb 15, 2022
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,059,280
- Issue date Jul 13, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,950
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,953
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,952
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 11,020,951
- Issue date Jun 1, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 10,964,562
- Issue date Mar 30, 2021
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 10,861,699
- Issue date Dec 8, 2020
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 10,748,770
- Issue date Aug 18, 2020
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 10,636,662
- Issue date Apr 28, 2020
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substates
- Patent number 10,504,730
- Issue date Dec 10, 2019
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding substrates
- Patent number 10,279,575
- Issue date May 7, 2019
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 10,109,487
- Issue date Oct 23, 2018
- EV Group E. Thallner GmbH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20230294390
- Publication date Sep 21, 2023
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20230117625
- Publication date Apr 20, 2023
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20220139735
- Publication date May 5, 2022
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20220130674
- Publication date Apr 28, 2022
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20210291504
- Publication date Sep 23, 2021
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20210183665
- Publication date Jun 17, 2021
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20210074544
- Publication date Mar 11, 2021
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20200335341
- Publication date Oct 22, 2020
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20200219726
- Publication date Jul 9, 2020
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20200066529
- Publication date Feb 27, 2020
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20190228995
- Publication date Jul 25, 2019
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217594
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190217595
- Publication date Jul 18, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210348
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210349
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190210350
- Publication date Jul 11, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20190019677
- Publication date Jan 17, 2019
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING OF SUBSTRATES
- Publication number 20180076037
- Publication date Mar 15, 2018
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20150210057
- Publication date Jul 30, 2015
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleithner
- B32 - LAYERED PRODUCTS

Florian Kurz

Person

Patents Grantslast 30 patents

Device and method for bonding of two substrates

Device and method for bonding substrates

Device and method for bonding of two substrates

Device and method for bonding of substrates

Device and method for bonding of two substrates

Device and method for bonding of substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding of two substrates

Device and method for bonding of substrates

Device and method for bonding of substrates

Device and method for bonding of substrates

Device and method for bonding of substates

Device and method for bonding substrates

Method for bonding substrates

Patents Applicationslast 30 patents

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

METHOD FOR BONDING OF SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES