Floyd E. Stumpff

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Elmira, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Bonded pin extrusion die and method
- Patent number 5,964,020
- Issue date Oct 12, 1999
- Corning Incorporated
- Harry A. Kragle
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of making bonded pin extrusion die
- Patent number 5,761,787
- Issue date Jun 9, 1998
- Corning Incorporated
- Harry A. Kragle
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Honeycomb extrusion die and methods
- Patent number 5,702,659
- Issue date Dec 30, 1997
- Corning Incorporated
- Harry A. Kragle
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for forming a uniform skin on a cellular subst...
- Patent number 5,256,054
- Issue date Oct 26, 1993
- Corning Incorporated
- Joseph F. Cocchetto
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for forming a uniform skin on a cellular substrate
- Patent number 5,219,509
- Issue date Jun 15, 1993
- Corning Incorporated
- Joseph F. Cocchetto
- B28 - WORKING CEMENT, CLAY, OR STONE