Fon-Shan Huang

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Chutung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Imprinting-damascene process for metal interconnection
- Patent number 7,214,611
- Issue date May 8, 2007
- National Tsing Hua University
- Jen Fu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu seed layer deposition for ULSI metalization
- Patent number 6,511,609
- Issue date Jan 28, 2003
- Industrial Technology Research Institute
- Ching-Han Jan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of fabricating imprint lithography template
- Publication number 20080131822
- Publication date Jun 5, 2008
- National Tsing Hua University
- Chen-Liang Liao
- B82 - NANO-TECHNOLOGY
Information Patent Application
Imprinting-damascene process for metal interconnection
- Publication number 20060199380
- Publication date Sep 7, 2006
- National Tsing Hua University
- Jen Fu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu seed layer deposition for ULSI metalization
- Publication number 20020113038
- Publication date Aug 22, 2002
- Ching-Han Jan
- H01 - BASIC ELECTRIC ELEMENTS