Fong Mei Lum

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a heterogeneous solder joint and method f...
- Patent number 11,682,644
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an optical inspection feature
- Patent number 10,431,560
- Issue date Oct 1, 2019
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing molded semiconductor packages having an opt...
- Patent number 9,806,043
- Issue date Oct 31, 2017
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Adaptive Flip Chip Bonding for Semiconductor Packages
- Publication number 20240213035
- Publication date Jun 27, 2024
- INFINEON TECHNOLOGIES AG
- Chew Yeek Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...
- Publication number 20220005778
- Publication date Jan 6, 2022
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package
- Publication number 20200006267
- Publication date Jan 2, 2020
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package Having an Optical Inspection Feature
- Publication number 20180033752
- Publication date Feb 1, 2018
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Molded Semiconductor Packages Having an Opt...
- Publication number 20170256509
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS