Fong Yau Sam Li

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method to deposit a seeding layer for electroless copper plating
- Patent number 6,495,200
- Issue date Dec 17, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Lap Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to form uniform silicide features
- Patent number 6,281,117
- Issue date Aug 28, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Lap Chan
- H01 - BASIC ELECTRIC ELEMENTS