Fong-Yuan Chang

Person

Taichang, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,368,148
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit fin structure
- Patent number 12,321,680
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsiang Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device with improved layout
- Patent number 12,315,862
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods of estimating thermal properties of semiconduct...
- Patent number 12,299,369
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yi Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for generating layout diagram including wiring ar...
- Patent number 12,277,379
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making electrostatic discharge protection cell and antenn...
- Patent number 12,272,658
- Issue date Apr 8, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna effect protection and electrostatic discharge protection fo...
- Patent number 12,224,482
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via in integrated circuit packaging
- Patent number 12,223,252
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for generating layout diagram including wiring ar...
- Patent number 12,216,981
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Logic circuits with reduced transistor counts
- Patent number 12,190,034
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Lin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device having bitline segmented into bitline segments and re...
- Patent number 12,176,016
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Lien Linus Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,159,791
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structures for three-dimensional system on integra...
- Patent number 12,154,842
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a high cell density
- Patent number 12,087,690
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cell region including portion of conductor of another cell region a...
- Patent number 12,079,561
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 12,074,148
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 12,062,641
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin modification for standard cells
- Patent number 12,056,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Layout design methodology for stacked devices
- Patent number 12,027,513
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and system of forming integrated circuit
- Patent number 12,009,260
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ka Fai Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 12,002,776
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Chou Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a cell having pins and semiconductor devic...
- Patent number 11,983,475
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pin-Dai Sue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 11,967,591
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection cell and antenna integrated with...
- Patent number 11,942,441
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with improved layout
- Patent number 11,935,894
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Arrangement of power-grounds in package structures
- Patent number 11,929,340
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC power grid
- Patent number 11,923,271
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Noor E. V. Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,923,302
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of generating integrated circuit layout
- Patent number 11,908,853
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
- Publication number 20250239541
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF ESTIMATING THERMAL PROPERTIES OF SEMICONDUCT...
- Publication number 20250232105
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yi Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20250210452
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Effect Protection and Electrostatic Discharge Protection fo...
- Publication number 20250183515
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING BITLINE SEGMENTED INTO BITLINE SEGMENTS AND RE...
- Publication number 20250078890
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-LIEN LINUS LU
- G11 - INFORMATION STORAGE
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20250054775
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation Structures
- Publication number 20240413052
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having a High Cell Density
- Publication number 20240387373
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387394
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIAS IN INTEGRATED CIRCUIT PACKAGING
- Publication number 20240386183
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240387377
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MANUFACTURING METHOD
- Publication number 20240370633
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN MODIFICATION FOR STANDARD CELLS
- Publication number 20240354487
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LAYOUT DESIGN METHODOLOGY FOR STACKED DEVICES
- Publication number 20240312978
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan CHANG
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR MANUFACTURING A CELL HAVING PINS AND SEMICONDUCTOR DEVIC...
- Publication number 20240296272
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Dai SUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS OF SELECTING DEVICES IN CIRCUIT DESIGN
- Publication number 20240296268
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20240274561
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-CHOU TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
- Publication number 20240234347
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC POWER GRID
- Publication number 20240213121
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Noor E.V. Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20240213237
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT
- Publication number 20240203997
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Arrangement of Power-Grounds in Package Structures
- Publication number 20240178177
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Effect Protection and Electrostatic Discharge Protection fo...
- Publication number 20240120639
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240105619
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION
- Publication number 20240096800
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fei Fan DUAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT FIN STRUCTURE
- Publication number 20240086612
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CELL REGION INCLUDING PORTION OF CONDUCTOR OF ANOTHER CELL REGION A...
- Publication number 20240020457
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Info Packages Including Thermal Dissipation Blocks
- Publication number 20240021441
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Fong-Yuan Chang

Person

Patents Grantslast 30 patents

Info packages including thermal dissipation blocks

Integrated circuit fin structure

Integrated circuit device with improved layout

Systems and methods of estimating thermal properties of semiconduct...

Method and system for generating layout diagram including wiring ar...

Method of making electrostatic discharge protection cell and antenn...

Semiconductor package having an encapulant comprising conductive fi...

Antenna effect protection and electrostatic discharge protection fo...

Through-silicon via in integrated circuit packaging

System and method for generating layout diagram including wiring ar...

Logic circuits with reduced transistor counts

Memory device having bitline segmented into bitline segments and re...

Info packages including thermal dissipation blocks

Heat dissipation structures for three-dimensional system on integra...

Integrated circuit having a high cell density

Cell region including portion of conductor of another cell region a...

Heat dissipation in semiconductor packages and methods of forming same

Integrated circuit including a first semiconductor wafer and a seco...

Pin modification for standard cells

Layout design methodology for stacked devices

Method and system of forming integrated circuit

Interconnect structure and method for forming the same

Method for manufacturing a cell having pins and semiconductor devic...

Info packages including thermal dissipation blocks

Electrostatic discharge protection cell and antenna integrated with...

Integrated circuit device with improved layout

Arrangement of power-grounds in package structures

3D IC power grid

Semiconductor device and method of manufacture

Integrated circuit and method of generating integrated circuit layout

Patents Applicationslast 30 patents

METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...

SYSTEMS AND METHODS OF ESTIMATING THERMAL PROPERTIES OF SEMICONDUCT...

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

Antenna Effect Protection and Electrostatic Discharge Protection fo...

MEMORY DEVICE HAVING BITLINE SEGMENTED INTO BITLINE SEGMENTS AND RE...

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

Heat Dissipation Structures

Integrated Circuit Having a High Cell Density

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

THROUGH-SILICON VIAS IN INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

INTEGRATED CIRCUIT MANUFACTURING METHOD

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

PIN MODIFICATION FOR STANDARD CELLS

LAYOUT DESIGN METHODOLOGY FOR STACKED DEVICES

METHOD FOR MANUFACTURING A CELL HAVING PINS AND SEMICONDUCTOR DEVIC...

METHODS OF SELECTING DEVICES IN CIRCUIT DESIGN

INTERCONNECT STRUCTURE

METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...

3D IC POWER GRID

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT

Arrangement of Power-Grounds in Package Structures

Antenna Effect Protection and Electrostatic Discharge Protection fo...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION

INTEGRATED CIRCUIT FIN STRUCTURE

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

CELL REGION INCLUDING PORTION OF CONDUCTOR OF ANOTHER CELL REGION A...

Info Packages Including Thermal Dissipation Blocks