Fong-Yuan Chang

Person

Taichang, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a cell having pins and semiconductor devic...
- Patent number 11,983,475
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pin-Dai Sue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 11,967,591
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection cell and antenna integrated with...
- Patent number 11,942,441
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- HoChe Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with improved layout
- Patent number 11,935,894
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Arrangement of power-grounds in package structures
- Patent number 11,929,340
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC power grid
- Patent number 11,923,271
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Noor E. V. Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,923,302
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of generating integrated circuit layout
- Patent number 11,908,853
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit fin structure manufacturing method
- Patent number 11,861,282
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsiang Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with reduced resistance and method for manufac...
- Patent number 11,854,973
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fei Fan Duan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna effect protection and electrostatic discharge protection fo...
- Patent number 11,824,254
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 11,817,324
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having bitline segmented into bitline segments and re...
- Patent number 11,817,139
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Lien Linus Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
System for generating layout diagram including wiring arrangement
- Patent number 11,790,151
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for generating layout diagram including wiring arrangement
- Patent number 11,775,727
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Logic circuits with reduced transistor counts
- Patent number 11,755,798
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Lin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Layout design methodology for stacked devices
- Patent number 11,756,951
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Heat dissipation structures
- Patent number 11,749,584
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including protruding conductor cell regions
- Patent number 11,727,188
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fong-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Standard cells and variations thereof within a standard cell library
- Patent number 11,704,472
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacutring Co., Ltd.
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromagnetic shielding metal-insulator-metal capacitor structure
- Patent number 11,694,973
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui Yu Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of designing a device
- Patent number 11,675,954
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 11,658,157
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and layout method for standard cell structures
- Patent number 11,636,249
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal cut region location system
- Patent number 11,636,248
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Chan Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pin modification for standard cells
- Patent number 11,637,098
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through-silicon vias in integrated circuit packaging
- Patent number 11,586,797
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing a cell having pins and semiconductor devic...
- Patent number 11,574,107
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pin-Dai Sue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with cell region, method of generating layout...
- Patent number 11,568,125
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Antenna Effect Protection and Electrostatic Discharge Protection fo...
- Publication number 20240120639
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240105619
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION
- Publication number 20240096800
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fei Fan DUAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT FIN STRUCTURE
- Publication number 20240086612
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CELL REGION INCLUDING PORTION OF CONDUCTOR OF ANOTHER CELL REGION A...
- Publication number 20240020457
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Info Packages Including Thermal Dissipation Blocks
- Publication number 20240021441
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURE...
- Publication number 20230402359
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ho Che Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR GENERATING LAYOUT DIAGRAM INCLUDING WIRING AR...
- Publication number 20230394219
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR GENERATING LAYOUT DIAGRAM INCLUDING WIRING AR...
- Publication number 20230385522
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOS...
- Publication number 20230387078
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CIRCUITS WITH REDUCED TRANSISTOR COUNTS
- Publication number 20230376661
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Layout Design Methodology For Stacked Devices
- Publication number 20230361104
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan Chang
- G11 - INFORMATION STORAGE
Information Patent Application
HEAT DISSIPATION STRUCTURES
- Publication number 20230352366
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsiang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...
- Publication number 20230299052
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CUT REGION LOCATION METHOD
- Publication number 20230267262
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chan YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PIN MODIFICATION FOR STANDARD CELLS
- Publication number 20230253396
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMALLY-AWARE SEMICONDUCTOR PACKAGES
- Publication number 20230223379
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA IN INTEGRATED CIRCUIT PACKAGING
- Publication number 20230205967
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING A CELL HAVING PINS AND SEMICONDUCTOR DEVIC...
- Publication number 20230195991
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Dai SUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH CELL REGION
- Publication number 20230177249
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Hsiung CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230139843
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF GENERATING INTEGRATED CIRCUIT LAYOUT
- Publication number 20230121153
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-Yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS OF ESTIMATING THERMAL PROPERTIES OF SEMICONDUCT...
- Publication number 20230117009
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yi Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT FIN STRUCTURE MANUFACTURING METHOD
- Publication number 20230113014
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20230109128
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH...
- Publication number 20230061812
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HoChe YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT
- Publication number 20230057672
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Fong-yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20230037331
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT DESIGN FOR HEADER CELL IN 3D INTEGRATED CIRCUITS
- Publication number 20220384414
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHENG-YU LIN
- H01 - BASIC ELECTRIC ELEMENTS

Fong-Yuan Chang

Person

Patents Grantslast 30 patents

Method for manufacturing a cell having pins and semiconductor devic...

Info packages including thermal dissipation blocks

Electrostatic discharge protection cell and antenna integrated with...

Integrated circuit device with improved layout

Arrangement of power-grounds in package structures

3D IC power grid

Semiconductor device and method of manufacture

Integrated circuit and method of generating integrated circuit layout

Integrated circuit fin structure manufacturing method

Semiconductor device with reduced resistance and method for manufac...

Semiconductor package having an encapsulant comprising conductive f...

Antenna effect protection and electrostatic discharge protection fo...

Info packages including thermal dissipation blocks

Memory device having bitline segmented into bitline segments and re...

System for generating layout diagram including wiring arrangement

Method for generating layout diagram including wiring arrangement

Logic circuits with reduced transistor counts

Layout design methodology for stacked devices

Heat dissipation structures

Semiconductor device including protruding conductor cell regions

Standard cells and variations thereof within a standard cell library

Electromagnetic shielding metal-insulator-metal capacitor structure

Method of designing a device

Integrated circuit including a first semiconductor wafer and a seco...

Integrated circuit and layout method for standard cell structures

Metal cut region location system

Pin modification for standard cells

Through-silicon vias in integrated circuit packaging

Method for manufacturing a cell having pins and semiconductor devic...

Semiconductor device with cell region, method of generating layout...

Patents Applicationslast 30 patents

Antenna Effect Protection and Electrostatic Discharge Protection fo...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE INCLUDING PARALLEL CONFIGURATION

INTEGRATED CIRCUIT FIN STRUCTURE

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

CELL REGION INCLUDING PORTION OF CONDUCTOR OF ANOTHER CELL REGION A...

Info Packages Including Thermal Dissipation Blocks

SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURE...

METHOD AND SYSTEM FOR GENERATING LAYOUT DIAGRAM INCLUDING WIRING AR...

SYSTEM AND METHOD FOR GENERATING LAYOUT DIAGRAM INCLUDING WIRING AR...

SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOS...

LOGIC CIRCUITS WITH REDUCED TRANSISTOR COUNTS

Layout Design Methodology For Stacked Devices

HEAT DISSIPATION STRUCTURES

INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...

METAL CUT REGION LOCATION METHOD

PIN MODIFICATION FOR STANDARD CELLS

THERMALLY-AWARE SEMICONDUCTOR PACKAGES

THROUGH-SILICON VIA IN INTEGRATED CIRCUIT PACKAGING

METHOD FOR MANUFACTURING A CELL HAVING PINS AND SEMICONDUCTOR DEVIC...

SEMICONDUCTOR DEVICE WITH CELL REGION

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

INTEGRATED CIRCUIT AND METHOD OF GENERATING INTEGRATED CIRCUIT LAYOUT

SYSTEMS AND METHODS OF ESTIMATING THERMAL PROPERTIES OF SEMICONDUCT...

INTEGRATED CIRCUIT FIN STRUCTURE MANUFACTURING METHOD

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH...

INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

LAYOUT DESIGN FOR HEADER CELL IN 3D INTEGRATED CIRCUITS