Foong Wei KUONG

Follow

Person

Petaling Jaya, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Ground contact of an integrated circuit testing apparatus
- Patent number 9,658,248
- Issue date May 23, 2017
- JF Microtechnology Sdn. Bhd.
- Foong Wei Kuong
- G01 - MEASURING TESTING
Information Patent Grant
Multiple rigid contact solution for IC testing
- Patent number 9,182,424
- Issue date Nov 10, 2015
- JF Microtechnology Sdn. Bhd.
- Foong Wei Kuong
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
GROUND CONTACT OF AN INTEGRATED CIRCUIT TESTING APPARATUS
- Publication number 20140103952
- Publication date Apr 17, 2014
- JF Microtechnology Sdn. Bhd.
- Foong Wei KUONG
- G01 - MEASURING TESTING
Information Patent Application
MULTIPLE RIGID CONTACT SOLUTION FOR IC TESTING
- Publication number 20130249583
- Publication date Sep 26, 2013
- JF Microtechnology Sdn. Bhd.
- Foong Wei KUONG
- G01 - MEASURING TESTING