Ford B. Grigg

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic device wafers and methods of manufacturing
- Patent number 8,455,983
- Issue date Jun 4, 2013
- Micron Technology, Inc.
- Alan G. Wood
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic device wafers and methods of manufacturing
- Patent number 8,062,958
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Alan G. Wood
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin flip-chip method
- Patent number 7,811,903
- Issue date Oct 12, 2010
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced, self-aligning conductive structures for semiconductor d...
- Patent number 7,557,452
- Issue date Jul 7, 2009
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin flip-chip method
- Patent number 7,291,543
- Issue date Nov 6, 2007
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating stiffeners for flexible substrates
- Patent number 7,189,600
- Issue date Mar 13, 2007
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support ring for use with a contact pad and semiconductor device co...
- Patent number 7,170,171
- Issue date Jan 30, 2007
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thick solder mask for confining encapsulant material over selected...
- Patent number 7,138,724
- Issue date Nov 21, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and stencil for extruding material on a substrate
- Patent number 7,134,390
- Issue date Nov 14, 2006
- Micron Technology, Inc.
- Chad Cobbley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of encapsulating selected locations of a semiconductor die...
- Patent number 7,125,748
- Issue date Oct 24, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for mounting microelectronic pa...
- Patent number 7,122,905
- Issue date Oct 17, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assemblies including interposers with dams pro...
- Patent number 7,115,981
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for providing support for conductive structures protruding...
- Patent number 7,109,106
- Issue date Sep 19, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating interposers including upwardly protruding da...
- Patent number 7,064,002
- Issue date Jun 20, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating interposers including upwardly protruding dams
- Patent number 7,041,532
- Issue date May 9, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape stiffener, semiconductor device component assemblies including...
- Patent number 7,029,954
- Issue date Apr 18, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of encapsulating selected locations of a semiconductor die...
- Patent number 6,984,545
- Issue date Jan 10, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LOC semiconductor assembled with room temperature adhesive
- Patent number 6,979,888
- Issue date Dec 27, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for labeling semiconductor device components
- Patent number 6,939,501
- Issue date Sep 6, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for fabricating external contacts on semiconductor components
- Patent number 6,926,191
- Issue date Aug 9, 2005
- Micron Technology, Inc.
- Ford Grigg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin flip-chip method
- Patent number 6,905,946
- Issue date Jun 14, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring positionable about a periphery of a contact pad, semiconductor...
- Patent number 6,902,995
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape stiffener, semiconductor device component assemblies including...
- Patent number 6,900,078
- Issue date May 31, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support ring for use with a contact pad and semiconductor device co...
- Patent number 6,882,049
- Issue date Apr 19, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System with polymer masking flux for fabricating external contacts...
- Patent number 6,854,633
- Issue date Feb 15, 2005
- Micron Technology, Inc.
- Ford Grigg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing LOC semiconductor assembled with room tempe...
- Patent number 6,787,396
- Issue date Sep 7, 2004
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape stiffener, semiconductor device component assemblies including...
- Patent number 6,746,899
- Issue date Jun 8, 2004
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape stiffener, semiconductor device component assemblies including...
- Patent number 6,740,962
- Issue date May 25, 2004
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stereolithographically marked semiconductor devices and methods
- Patent number 6,706,374
- Issue date Mar 16, 2004
- Micron Technology, Inc.
- Ford B. Grigg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stereolithographically marked semiconductor devices and methods
- Patent number 6,703,105
- Issue date Mar 9, 2004
- Micron Technology, Inc.
- Ford B. Grigg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING
- Publication number 20120070959
- Publication date Mar 22, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING
- Publication number 20100252915
- Publication date Oct 7, 2010
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FLIP-CHIP METHOD
- Publication number 20080048343
- Publication date Feb 28, 2008
- Micron Technology, Inc.
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for fabricating stiffeners for flexible substrates
- Publication number 20070172992
- Publication date Jul 26, 2007
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for fabricating reinforced, self-aligning conductive struct...
- Publication number 20070148817
- Publication date Jun 28, 2007
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical connection methods employing corresponding, insulator-co...
- Publication number 20070148818
- Publication date Jun 28, 2007
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder masks used in encapsulation, assemblies including the solar...
- Publication number 20060205117
- Publication date Sep 14, 2006
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for fabricating stiffeners for flexible substrates
- Publication number 20060121649
- Publication date Jun 8, 2006
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOC semiconductor assembled with room temperature adhesive
- Publication number 20060022314
- Publication date Feb 2, 2006
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Markings for use with semiconductor device components
- Publication number 20050285278
- Publication date Dec 29, 2005
- Ford B. Grigg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and stencil for extruding material on a substrate
- Publication number 20050274267
- Publication date Dec 15, 2005
- Chad Cobbley
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method and stencil for extruding material on a substrate
- Publication number 20050268801
- Publication date Dec 8, 2005
- Chad Cobbley
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Methods for fabricating electronic components to include supports f...
- Publication number 20050227411
- Publication date Oct 13, 2005
- Ford B. Grigg
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Thin flip-chip method
- Publication number 20050208734
- Publication date Sep 22, 2005
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of encapsulating selected locations of a semiconductor die...
- Publication number 20050181545
- Publication date Aug 18, 2005
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support ring for use with a contact pad and semiconductor device co...
- Publication number 20050156314
- Publication date Jul 21, 2005
- Ford B. Grigg
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Tape stiffener, semiconductor device component assemblies including...
- Publication number 20040224442
- Publication date Nov 11, 2004
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tape stiffener and semiconductor device component assemblies includ...
- Publication number 20040212062
- Publication date Oct 28, 2004
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for fabricating interposers including upwardly protruding DAMS
- Publication number 20040166607
- Publication date Aug 26, 2004
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape stiffener, semiconductor device component assemblies including...
- Publication number 20040142507
- Publication date Jul 22, 2004
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for finishing microelectronic device packages
- Publication number 20040104200
- Publication date Jun 3, 2004
- Steven P. Nally
- B24 - GRINDING POLISHING
Information Patent Application
Thick solder mask for confining encapsulant material over selected...
- Publication number 20040080027
- Publication date Apr 29, 2004
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies including interposers with dams pro...
- Publication number 20040070061
- Publication date Apr 15, 2004
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and stencil for extruding material on a substrate
- Publication number 20040011228
- Publication date Jan 22, 2004
- Chad Cobbley
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Microelectronic devices and methods for mounting microelectronic pa...
- Publication number 20040012930
- Publication date Jan 22, 2004
- Ford B. Grigg
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Thick solder mask for confining encapsulant material over selected...
- Publication number 20040014255
- Publication date Jan 22, 2004
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for labeling semiconductor device components
- Publication number 20040000744
- Publication date Jan 1, 2004
- Ford B. Grigg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Masking flux for semiconductor components
- Publication number 20030201309
- Publication date Oct 30, 2003
- Ford Grigg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing LOC semiconductor assembled with room tempe...
- Publication number 20030176019
- Publication date Sep 18, 2003
- Ford B. Grigg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape stiffener, semiconductor device component assemblies including...
- Publication number 20030176021
- Publication date Sep 18, 2003
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ford B. Grigg

Person

Patents Grantslast 30 patents

Microelectronic device wafers and methods of manufacturing

Microelectronic device wafers and methods of manufacturing

Thin flip-chip method

Reinforced, self-aligning conductive structures for semiconductor d...

Thin flip-chip method

Methods for fabricating stiffeners for flexible substrates

Support ring for use with a contact pad and semiconductor device co...

Thick solder mask for confining encapsulant material over selected...

Method and stencil for extruding material on a substrate

Methods of encapsulating selected locations of a semiconductor die...

Microelectronic devices and methods for mounting microelectronic pa...

Semiconductor device assemblies including interposers with dams pro...

Methods for providing support for conductive structures protruding...

Method for fabricating interposers including upwardly protruding da...

Methods for fabricating interposers including upwardly protruding dams

Tape stiffener, semiconductor device component assemblies including...

Methods of encapsulating selected locations of a semiconductor die...

LOC semiconductor assembled with room temperature adhesive

Methods for labeling semiconductor device components

Process for fabricating external contacts on semiconductor components

Thin flip-chip method

Ring positionable about a periphery of a contact pad, semiconductor...

Tape stiffener, semiconductor device component assemblies including...

Support ring for use with a contact pad and semiconductor device co...

System with polymer masking flux for fabricating external contacts...

Method of manufacturing LOC semiconductor assembled with room tempe...

Tape stiffener, semiconductor device component assemblies including...

Tape stiffener, semiconductor device component assemblies including...

Stereolithographically marked semiconductor devices and methods

Stereolithographically marked semiconductor devices and methods

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING

MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING

THIN FLIP-CHIP METHOD

Methods for fabricating stiffeners for flexible substrates

Methods for fabricating reinforced, self-aligning conductive struct...

Electrical connection methods employing corresponding, insulator-co...

Solder masks used in encapsulation, assemblies including the solar...

Methods for fabricating stiffeners for flexible substrates

LOC semiconductor assembled with room temperature adhesive

Markings for use with semiconductor device components

Method and stencil for extruding material on a substrate

Method and stencil for extruding material on a substrate

Methods for fabricating electronic components to include supports f...

Thin flip-chip method

Methods of encapsulating selected locations of a semiconductor die...

Support ring for use with a contact pad and semiconductor device co...

Tape stiffener, semiconductor device component assemblies including...

Tape stiffener and semiconductor device component assemblies includ...

Methods for fabricating interposers including upwardly protruding DAMS

Tape stiffener, semiconductor device component assemblies including...

Methods for finishing microelectronic device packages

Thick solder mask for confining encapsulant material over selected...

Semiconductor device assemblies including interposers with dams pro...

Method and stencil for extruding material on a substrate

Microelectronic devices and methods for mounting microelectronic pa...

Thick solder mask for confining encapsulant material over selected...

Methods for labeling semiconductor device components

Masking flux for semiconductor components

Method of manufacturing LOC semiconductor assembled with room tempe...

Tape stiffener, semiconductor device component assemblies including...