Fortunato Lopez

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Unterhaching, DE

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Patents Grantslast 30 patents

Information Patent Grant
Lead frames for semiconductor packages
- Patent number 11,152,288
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Eric Lopez Bonifacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a die pad with a dam-like configuration
- Patent number 11,031,321
- Issue date Jun 8, 2021
- Infineon Technologies AG
- Rainer Pelzer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING A SEMICONDUCTOR PACKAGE
- Publication number 20230131909
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Rainald Sander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20220199478
- Publication date Jun 23, 2022
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20200343166
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Eric Lopez Bonifacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Die Pad with a Dam-Like Configuration
- Publication number 20200294894
- Publication date Sep 17, 2020
- Rainer Pelzer
- H01 - BASIC ELECTRIC ELEMENTS