Francesco Preda

Person

New Braunfels, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dense via pitch interconnect to increase wiring density
- Patent number 12,266,598
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Francesco Preda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitors for core and adjacent build up layers
- Patent number 11,388,821
- Issue date Jul 12, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitors for core and adjacent build up layers
- Patent number 10,660,209
- Issue date May 19, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for circuit substrate having post-fed die side p...
- Patent number 8,722,536
- Issue date May 13, 2014
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Continuously referencing signals over multiple layers in laminate p...
- Patent number 8,716,851
- Issue date May 6, 2014
- International Business Machines Corporation
- Francesco Preda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for circuit substrate having post-fed die side p...
- Patent number 8,586,476
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Continuously referencing signals over multiple layers in laminate p...
- Patent number 8,158,461
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Francesco Preda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate having post-fed die side power supply connections
- Patent number 7,863,724
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
- Publication number 20240234284
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Francesco PREDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
- Publication number 20240136270
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Francesco PREDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS
- Publication number 20200245466
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dedicated Integrated Circuit Chip Carrier Plane Connected to Decoup...
- Publication number 20200075468
- Publication date Mar 5, 2020
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS
- Publication number 20190150287
- Publication date May 16, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...
- Publication number 20130316534
- Publication date Nov 28, 2013
- International Business Machines Corporation
- Daniel Douriet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Continuously Referencing Signals Over Multiple Layers in Laminate P...
- Publication number 20120174047
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...
- Publication number 20100330797
- Publication date Dec 30, 2010
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Continuously Referencing Signals Over Multiple Layers in Laminate P...
- Publication number 20090256253
- Publication date Oct 15, 2009
- International Business Machines Corporation
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit Substrate Having Post-Fed Die Side Power Supply Connections
- Publication number 20090200074
- Publication date Aug 13, 2009
- International Business Machines Corporation
- Daniel Douriet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Continuously Referencing Signals over Multiple Layers in Laminate P...
- Publication number 20080093726
- Publication date Apr 24, 2008
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Francesco Preda

Person

Patents Grantslast 30 patents

Dense via pitch interconnect to increase wiring density

Thin film capacitors for core and adjacent build up layers

Thin film capacitors for core and adjacent build up layers

Fabrication method for circuit substrate having post-fed die side p...

Continuously referencing signals over multiple layers in laminate p...

Fabrication method for circuit substrate having post-fed die side p...

Continuously referencing signals over multiple layers in laminate p...

Circuit substrate having post-fed die side power supply connections

Patents Applicationslast 30 patents

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS

Dedicated Integrated Circuit Chip Carrier Plane Connected to Decoup...

THIN FILM CAPACITORS FOR CORE AND ADJACENT BUILD UP LAYERS

FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...

Continuously Referencing Signals Over Multiple Layers in Laminate P...

FABRICATION METHOD FOR CIRCUIT SUBSTRATE HAVING POST-FED DIE SIDE P...

Continuously Referencing Signals Over Multiple Layers in Laminate P...

Circuit Substrate Having Post-Fed Die Side Power Supply Connections

Continuously Referencing Signals over Multiple Layers in Laminate P...