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Francis C. Tambwe
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Malta, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Methods of forming alignment marks and overlay marks on integrated...
Patent number
9,515,026
Issue date
Dec 6, 2016
GLOBALFOUNDRIES Inc.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming alignment marks and overlay marks on integrated...
Patent number
9,275,890
Issue date
Mar 1, 2016
GLOBALFOUNDRIES Inc.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming a FinFET semiconductor device with undoped fins
Patent number
9,105,507
Issue date
Aug 11, 2015
GLOBALFOUNDRIES Inc.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual work function FinFET structures and methods for fabricating th...
Patent number
8,975,141
Issue date
Mar 10, 2015
GLOBALFOUNDRIES, INC.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming a finfet semiconductor device with undoped fins
Patent number
8,969,932
Issue date
Mar 3, 2015
GLOBALFOUNDRIES Inc.
Andy C. Wei
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Methods for fabricating FinFET integrated circuits on bulk semicond...
Patent number
8,603,893
Issue date
Dec 10, 2013
GLOBALFOUNDRIES, INC.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHODS OF FORMING ALIGNMENT MARKS AND OVERLAY MARKS ON INTEGRATED...
Publication number
20160141252
Publication date
May 19, 2016
GLOBALFOUNDRIES INC.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING A FINFET SEMICONDUCTOR DEVICE WITH UNDOPED FINS
Publication number
20150123214
Publication date
May 7, 2015
GLOBALFOUNDRIES INC.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING ALIGNMENT MARKS AND OVERLAY MARKS ON INTEGRATED...
Publication number
20140264631
Publication date
Sep 18, 2014
GLOBALFOUNDRIES INC.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING A FINFET SEMICONDUCTOR DEVICE WITH UNDOPED FINS
Publication number
20140159126
Publication date
Jun 12, 2014
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRUIT INCLUDING AN FIN-BASED DIODE AND METHODS OF ITS F...
Publication number
20140131831
Publication date
May 15, 2014
GLOBALFOUNDRIES, Inc.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL WORK FUNCTION FINFET STRUCTURES AND METHODS FOR FABRICATING TH...
Publication number
20140038402
Publication date
Feb 6, 2014
GLOBALFOUNDRIES INC.
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FABRICATING FINFET INTEGRATED CIRCUITS ON BULK SEMICOND...
Publication number
20130309838
Publication date
Nov 21, 2013
Andy C. Wei
H01 - BASIC ELECTRIC ELEMENTS