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Francis Koon Seong Poh
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Singapore, SG
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Patents Grants
last 30 patents
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Patent Grant
High performance chip scale leadframe package with thermal dissipat...
Patent number
7,323,769
Issue date
Jan 29, 2008
United Test & Assembly Center Ltd.
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
High performance chip scale leadframe with t-shape die pad and meth...
Publication number
20060202313
Publication date
Sep 14, 2006
UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS