Francis Steffen

Person

Aix-Les-Bains, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Tear-proof circuit
- Patent number 9,226,393
- Issue date Dec 29, 2015
- STMicroelectronics (Rousset) SAS
- Francis Steffen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Perforated electronic package and method of fabrication
- Patent number 9,196,590
- Issue date Nov 24, 2015
- STMicroelectronics (Grenoble 2) SAS
- Francis Steffen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tear-proof circuit
- Patent number 8,867,217
- Issue date Oct 21, 2014
- STMicroelectronics Rousset SAS
- Francis Steffen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Chip card micromodule as a surface-mount device
- Patent number 6,259,022
- Issue date Jul 10, 2001
- SGS-Thomson Microelectronics S.A.
- Francis Steffen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for manufacturing a chip card micromodule with protection b...
- Patent number 6,071,758
- Issue date Jun 6, 2000
- SGS-Thomson Microelectronics S.A.
- Francis Steffen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip card micromodule as a surface-mount device
- Patent number 5,917,706
- Issue date Jun 29, 1999
- SGS-Thomson Microelectronics S.A.
- Francis Steffen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Micromodule with protection barriers and a method for manufacturing...
- Patent number 5,898,216
- Issue date Apr 27, 1999
- SGS-Thomson Microelectronics S.A.
- Francis Steffen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip card system provided with an offset electronic circuit
- Patent number 5,574,270
- Issue date Nov 12, 1996
- SGS-Thomson Microelectronics, S.A.
- Francis Steffen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Smart card chip-based electronic circuit
- Patent number 5,311,396
- Issue date May 10, 1994
- SGS-Thomson Microelectronics, S.A.
- Francis Steffen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Encapsulation of electronic modules
- Patent number 5,147,982
- Issue date Sep 15, 1992
- SGS-Thomson Microelectronics S.A.
- Francis Steffen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing for containing a fragile element such as a logic circuit
- Patent number 5,107,073
- Issue date Apr 21, 1992
- SGS-Thomson Microelectronics S.A.
- Francis Steffen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of encapsulating an integrated circuit using a punched metal...
- Patent number 5,041,395
- Issue date Aug 20, 1991
- SGS-Thomson Microelectronics S.A.
- Francis Steffen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the encapsulation of integrated circuits
- Patent number 4,857,483
- Issue date Aug 15, 1989
- SGS-Thomson Microelectronics S.A.
- Francis Steffen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PERFORATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
- Publication number 20150262941
- Publication date Sep 17, 2015
- STMicroelectronics (Grenoble 2) SAS
- Francis Steffen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEAR-PROOF CIRCUIT
- Publication number 20150029275
- Publication date Jan 29, 2015
- STMicroelectronics (Rousset) SAS
- Francis Steffen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
TEAR-PROOF CIRCUIT
- Publication number 20100194645
- Publication date Aug 5, 2010
- STMICROELECTRONICS ROUSSET SAS
- Francis Steffen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for connecting a semiconductor chip onto an interconnection...
- Publication number 20060270110
- Publication date Nov 30, 2006
- STMicroelectronics S.A.
- Francis Steffen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromodule, particularly for chip card
- Publication number 20060261456
- Publication date Nov 23, 2006
- STMicroelectronics S.A.
- Francis Steffen
- G06 - COMPUTING CALCULATING COUNTING

Francis Steffen

Person

Patents Grantslast 30 patents

Tear-proof circuit

Perforated electronic package and method of fabrication

Tear-proof circuit

Chip card micromodule as a surface-mount device

Process for manufacturing a chip card micromodule with protection b...

Chip card micromodule as a surface-mount device

Micromodule with protection barriers and a method for manufacturing...

Chip card system provided with an offset electronic circuit

Smart card chip-based electronic circuit

Encapsulation of electronic modules

Housing for containing a fragile element such as a logic circuit

Method of encapsulating an integrated circuit using a punched metal...

Method for the encapsulation of integrated circuits

Patents Applicationslast 30 patents

PERFORATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION

TEAR-PROOF CIRCUIT

TEAR-PROOF CIRCUIT

Method for connecting a semiconductor chip onto an interconnection...

Micromodule, particularly for chip card