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Francisca Tung
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Los Gatos, CA, US
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last 30 patents
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Patent Grant
Bump formation on yielded semiconductor dies
Patent number
5,587,336
Issue date
Dec 24, 1996
VLSI Technology
Tsing-Chow Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sequential multilayer process for using fluorinated hydrocarbons as...
Patent number
5,387,495
Issue date
Feb 7, 1995
Digital Equipment Corporation
James C. K. Lee
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Structure for holding integrated circuit dies to be electroplated
Patent number
5,342,495
Issue date
Aug 30, 1994
VLSI Technology, Inc.
Francisca Tung
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Double-sided hybrid high density circuit board and method of making...
Patent number
5,072,075
Issue date
Dec 10, 1991
Digital Equipment Corporation
James C. K. Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multiple chip interconnection system and package
Patent number
4,692,839
Issue date
Sep 8, 1987
Digital Equipment Corporation
James C. K. Lee
H01 - BASIC ELECTRIC ELEMENTS