Francisco Gabriel Lozano Sanchez

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Tlajomulco de Zuniga, MX

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Patents Grantslast 30 patents

Information Patent Grant
Multi-surface heat sink suitable for multi-chip packages
- Patent number 11,495,518
- Issue date Nov 8, 2022
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES
- Publication number 20200251403
- Publication date Aug 6, 2020
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PIECE HEAT SPREADER FOR MULTI-CHIP PACKAGE
- Publication number 20200194332
- Publication date Jun 18, 2020
- Intel Corporation
- Sandeep Ahuja
- H01 - BASIC ELECTRIC ELEMENTS