Franciscus Henrikus Martinus Swartjes

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Eindhoven, NL

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Patents Grantslast 30 patents

Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 10,177,111
- Issue date Jan 8, 2019
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,704,823
- Issue date Jul 11, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,466,585
- Issue date Oct 11, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20170179076
- Publication date Jun 22, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20160276176
- Publication date Sep 22, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20160276306
- Publication date Sep 22, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS