Francois Marion

Person

Saint Egreve, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a plurality of island-shaped dipoles having...
- Patent number 9,985,067
- Issue date May 29, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid electronic device protected against humidity and method of p...
- Patent number 9,793,141
- Issue date Oct 17, 2017
- Commissariat a l'Energie Atomique et aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly method, of the flip-chip type, for connecting two electron...
- Patent number 9,368,473
- Issue date Jun 14, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting elements for producing hybrid electronic circuits
- Patent number 9,166,338
- Issue date Oct 20, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a connection component with hollow inserts
- Patent number 8,898,896
- Issue date Dec 2, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detector system with an optical function and method for making such...
- Patent number 8,735,819
- Issue date May 27, 2014
- Commissariat a l'Energie Atomique
- Manuel Fendler
- G01 - MEASURING TESTING
Information Patent Grant
Method of flip-chip hybridization for the forming of tight cavities...
- Patent number 8,664,778
- Issue date Mar 4, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nanoprinted device comprising metallic patterns and method of nanop...
- Patent number 8,329,311
- Issue date Dec 11, 2012
- Commissariat a l'Energie Atomique
- François Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding two electronic components
- Patent number 8,291,586
- Issue date Oct 23, 2012
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal lip seal and machine fitted with same seal
- Patent number 8,272,556
- Issue date Sep 25, 2012
- Commissariat a l'Energie Atomique
- Francois Marion
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method of thinning a block transferred to a substrate
- Patent number 8,252,363
- Issue date Aug 28, 2012
- Commissariat a l'Energie Atomique
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a matrix of individual electronic components a...
- Patent number 8,168,478
- Issue date May 1, 2012
- Commissariat a l'Energie Atomique
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering two elements together using a solder material
- Patent number 8,097,827
- Issue date Jan 17, 2012
- Commissariat a l'Energie Atomique
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection by fitting together two soldered inserts
- Patent number 8,093,728
- Issue date Jan 10, 2012
- Commissariat a l'Energie Atomique
- Francois Marion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a matrix of individual electronic components a...
- Patent number 8,058,656
- Issue date Nov 15, 2011
- Commissariat a l'Energie Atomique
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for hybridization of two components by using different sized...
- Patent number 7,938,311
- Issue date May 10, 2011
- Commissariat a l'Energie Atomique
- Francois Marion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of sealing or welding two elements to one another
- Patent number 7,772,041
- Issue date Aug 10, 2010
- Commissariat a l'Energie Atomique
- François Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing layers located on a hybrid circuit
- Patent number 7,759,261
- Issue date Jul 20, 2010
- Commissariat a l'Energie Atomique
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component having microtips and ductile conducting bumps
- Patent number 7,717,718
- Issue date May 18, 2010
- Commissariat a l'Energie Atomique
- Cécile Davoine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal chips by plasma from a layer compris...
- Patent number 7,691,735
- Issue date Apr 6, 2010
- Commissariat a l'Energie Atomique
- Laurent Grenouillet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding chips on a strained substrate and method of placi...
- Patent number 7,645,686
- Issue date Jan 12, 2010
- Commissariat a l'Energie Atomique
- Manuel Fendler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for connecting chips
- Patent number 7,569,940
- Issue date Aug 4, 2009
- Commissariat a l'Energie Atomique
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating a component, especially an electric or ele...
- Patent number 7,524,704
- Issue date Apr 28, 2009
- Commissariat a l'Energie Atomique
- François Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for passive alignment of optical waveguides and o...
- Patent number 7,031,578
- Issue date Apr 18, 2006
- Commissariate a l'Energie Atomique
- François Marion
- G02 - OPTICS
Information Patent Grant
Method and device for the passive alignment of optical fibers and o...
- Patent number 6,942,396
- Issue date Sep 13, 2005
- Commissariat a l'Energie Atomique
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for connection/disconnection of an optical fiber...
- Patent number 6,741,787
- Issue date May 25, 2004
- Commissariat a l'Energie Atomique
- François Marion
- G02 - OPTICS
Information Patent Grant
Optic device comprising a plurality of resonant cavities of differe...
- Patent number 6,639,928
- Issue date Oct 28, 2003
- Commissariat a l'Energie Atomique-C.E.A.
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a device having a cavity with controlled atmosphere
- Patent number 6,566,170
- Issue date May 20, 2003
- Commissariat a l'Energie Atomique
- François Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CONNECTING CROSS-COMPONENTS AT OPTIMISED DENSITY
- Publication number 20210280628
- Publication date Sep 9, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ELECTRONIC DEVICE PROTECTED AGAINST HUMIDITY AND METHOD OF P...
- Publication number 20170229321
- Publication date Aug 10, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PLURALITY OF ISLAND-SHAPED DIPOLES HAVING...
- Publication number 20160380017
- Publication date Dec 29, 2016
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20160233186
- Publication date Aug 11, 2016
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ASSEMBLY PROCESS COMPRISING PRE-COATING INTERCONNECT ELEM...
- Publication number 20150380395
- Publication date Dec 31, 2015
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly Method, of the Flip-Chip Type, for Connecting Two Electron...
- Publication number 20150235985
- Publication date Aug 20, 2015
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20140075747
- Publication date Mar 20, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING ELEMENTS FOR PRODUCING HYBRID ELECTRONIC CIRCUITS
- Publication number 20130267113
- Publication date Oct 10, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Francois MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FLIP-CHIP HYBRIDIZATION FOR THE FORMING OF TIGHT CAVITIES...
- Publication number 20130001807
- Publication date Jan 3, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AIRTIGHT ASSEMBLY OF TWO COMPONENTS AND METHOD FOR PRODUCING SUCH A...
- Publication number 20120120622
- Publication date May 17, 2012
- Commissariat L'Energie Atomique Et Aux Energies Alternatives
- François Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...
- Publication number 20110300487
- Publication date Dec 8, 2011
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENT WITH HOLLOW INSERTS AND METHOD FOR MAKING SAME
- Publication number 20110094789
- Publication date Apr 28, 2011
- COMMISSARIAT AL'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Francois Marion
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING...
- Publication number 20110041332
- Publication date Feb 24, 2011
- Commissariat A L'Energie Atomique Et Aux Energies Alternatives
- Damien Saint-Patrice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING TWO ELECTRONIC COMPONENTS
- Publication number 20110035925
- Publication date Feb 17, 2011
- Commissariat A L'Energie Atomique Et Aux Energie Alternatives
- Francois MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LIP SEAL AND MACHINE FITTED WITH SAID SEAL
- Publication number 20100243713
- Publication date Sep 30, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF THINNING A BLOCK TRANSFERRED TO A SUBSTRATE
- Publication number 20100124604
- Publication date May 20, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTOR SYSTEM WITH AN OPTICAL FUNCTION AND METHOD FOR MAKING SUCH...
- Publication number 20100123899
- Publication date May 20, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Manuel Fendler
- G02 - OPTICS
Information Patent Application
CONNECTION BY FITTING TOGETHER TWO SOLDERED INSERTS
- Publication number 20100072631
- Publication date Mar 25, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING METAL CHIPS BY PLASMA FROM A LAYER COMPRIS...
- Publication number 20090162657
- Publication date Jun 25, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Laurent Grenouillet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SOLDERING TWO ELEMENTS TOGETHER USING A SOLDER MATERIAL
- Publication number 20090145885
- Publication date Jun 11, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...
- Publication number 20090085045
- Publication date Apr 2, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS ON A STRAINED SUBSTRATE AND METHOD OF PLAC...
- Publication number 20090075423
- Publication date Mar 19, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Manuel Fendler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Provided With A Set Of Hard Conducting Microttips And Pro...
- Publication number 20080146071
- Publication date Jun 19, 2008
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Cecile Davoine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SEALING OR WELDING TWO ELEMENTS TO ONE ANOTHER
- Publication number 20080110013
- Publication date May 15, 2008
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Nanoprinted Device Comprising Metallic Patterns and Method of Nanop...
- Publication number 20080107877
- Publication date May 8, 2008
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Producing Layers Located on a Hybrid Circuit
- Publication number 20080045037
- Publication date Feb 21, 2008
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for connecting chips
- Publication number 20070111567
- Publication date May 17, 2007
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing means of connecting and/or soldering a component
- Publication number 20070049065
- Publication date Mar 1, 2007
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for encapsulating a component, especially an electric or ele...
- Publication number 20070048905
- Publication date Mar 1, 2007
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for hybridisation of two components by using different sized...
- Publication number 20070045387
- Publication date Mar 1, 2007
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Francois Marion
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Francois Marion

Person

Patents Grantslast 30 patents

Method of producing a hybridized device including microelectronic c...

Method of manufacturing a plurality of island-shaped dipoles having...

Hybrid electronic device protected against humidity and method of p...

Flip-chip assembly process comprising pre-coating interconnect elem...

Assembly method, of the flip-chip type, for connecting two electron...

Connecting elements for producing hybrid electronic circuits

Method of making a connection component with hollow inserts

Detector system with an optical function and method for making such...

Method of flip-chip hybridization for the forming of tight cavities...

Nanoprinted device comprising metallic patterns and method of nanop...

Method for bonding two electronic components

Metal lip seal and machine fitted with same seal

Method of thinning a block transferred to a substrate

Method for producing a matrix of individual electronic components a...

Method for soldering two elements together using a solder material

Connection by fitting together two soldered inserts

Method for producing a matrix of individual electronic components a...

Method for hybridization of two components by using different sized...

Method of sealing or welding two elements to one another

Method for producing layers located on a hybrid circuit

Electric component having microtips and ductile conducting bumps

Method for manufacturing metal chips by plasma from a layer compris...

Method of bonding chips on a strained substrate and method of placi...

Method and device for connecting chips

Method for encapsulating a component, especially an electric or ele...

Method and device for passive alignment of optical waveguides and o...

Method and device for the passive alignment of optical fibers and o...

Process and device for connection/disconnection of an optical fiber...

Optic device comprising a plurality of resonant cavities of differe...

Method for forming a device having a cavity with controlled atmosphere

Patents Applicationslast 30 patents

METHOD FOR CONNECTING CROSS-COMPONENTS AT OPTIMISED DENSITY

HYBRID ELECTRONIC DEVICE PROTECTED AGAINST HUMIDITY AND METHOD OF P...

METHOD OF MANUFACTURING A PLURALITY OF ISLAND-SHAPED DIPOLES HAVING...

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

FLIP-CHIP ASSEMBLY PROCESS COMPRISING PRE-COATING INTERCONNECT ELEM...

Assembly Method, of the Flip-Chip Type, for Connecting Two Electron...

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

CONNECTING ELEMENTS FOR PRODUCING HYBRID ELECTRONIC CIRCUITS

METHOD OF FLIP-CHIP HYBRIDIZATION FOR THE FORMING OF TIGHT CAVITIES...

AIRTIGHT ASSEMBLY OF TWO COMPONENTS AND METHOD FOR PRODUCING SUCH A...

METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...

CONNECTION COMPONENT WITH HOLLOW INSERTS AND METHOD FOR MAKING SAME

CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING...

METHOD FOR BONDING TWO ELECTRONIC COMPONENTS

METAL LIP SEAL AND MACHINE FITTED WITH SAID SEAL

METHOD OF THINNING A BLOCK TRANSFERRED TO A SUBSTRATE

DETECTOR SYSTEM WITH AN OPTICAL FUNCTION AND METHOD FOR MAKING SUCH...

CONNECTION BY FITTING TOGETHER TWO SOLDERED INSERTS

METHOD FOR MANUFACTURING METAL CHIPS BY PLASMA FROM A LAYER COMPRIS...

METHOD FOR SOLDERING TWO ELEMENTS TOGETHER USING A SOLDER MATERIAL

METHOD FOR PRODUCING A MATRIX OF INDIVIDUAL ELECTRONIC COMPONENTS A...

METHOD OF BONDING CHIPS ON A STRAINED SUBSTRATE AND METHOD OF PLAC...

Component Provided With A Set Of Hard Conducting Microttips And Pro...

METHOD OF SEALING OR WELDING TWO ELEMENTS TO ONE ANOTHER

Nanoprinted Device Comprising Metallic Patterns and Method of Nanop...

Method for Producing Layers Located on a Hybrid Circuit

Method and device for connecting chips

Method for producing means of connecting and/or soldering a component

Method for encapsulating a component, especially an electric or ele...

Method for hybridisation of two components by using different sized...