Frank A. Sanders

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Beaverton, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronic packaging using conductive interproser connector
- Patent number 7,385,288
- Issue date Jun 10, 2008
- Intel Corporation
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional flexible interposer
- Patent number 7,325,303
- Issue date Feb 5, 2008
- Intel Corporation
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packaging using conductive interposer connector
- Patent number 7,241,680
- Issue date Jul 10, 2007
- Intel Corporation
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional flexible interposer
- Patent number 7,201,583
- Issue date Apr 10, 2007
- Intel Corporation
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGING USING CONDUCTIVE INTERPROSER CONNECTOR
- Publication number 20070228562
- Publication date Oct 4, 2007
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-dimensional flexible interposer
- Publication number 20070082512
- Publication date Apr 12, 2007
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic packaging using conductive interposer connector
- Publication number 20050242434
- Publication date Nov 3, 2005
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL FLEXIBLE INTERPOSER
- Publication number 20050142900
- Publication date Jun 30, 2005
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR