Frank Armstrong

Person

Wylie, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Device with dummy metallic traces
- Patent number 11,990,399
- Issue date May 21, 2024
- Texas Instruments Incorporated
- Frank Armstrong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation of wafer level packaging
- Patent number 11,235,971
- Issue date Feb 1, 2022
- Texas Instruments Incorporated
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Singulation of wafer level packaging
- Patent number 10,611,632
- Issue date Apr 7, 2020
- Texas Instruments Incorporated
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal conduction by encapsulation
- Patent number 7,898,724
- Issue date Mar 1, 2011
- Texas Instruments Incorporated
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress relieved flat frame for DMD window
- Patent number 7,402,458
- Issue date Jul 22, 2008
- Texas Instruments Incorporated
- Bradley Morgan Haskett
- G02 - OPTICS
Information Patent Grant
Stress relieved frame
- Patent number 6,894,853
- Issue date May 17, 2005
- Texas Instruments Incorporated
- Bradley Morgan Haskett
- G02 - OPTICS
Information Patent Grant
System and method for measuring air flow at multiple points of an a...
- Patent number 6,722,210
- Issue date Apr 20, 2004
- Texas Instruments Incorporated
- Frank O. Armstrong
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for shielding in sputtering chambers
- Patent number 5,482,612
- Issue date Jan 9, 1996
- Texas Instruments Incorporated
- Frank O. Armstrong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PLANAR SURFACES ON SUBSTRATES
- Publication number 20230102345
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Frank ARMSTRONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF WAFER LEVEL PACKAGING
- Publication number 20200231434
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMAL CONDUCTION BY ENCAPSULATION
- Publication number 20100110527
- Publication date May 6, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stress relieved flat frame for DMD window
- Publication number 20050185252
- Publication date Aug 25, 2005
- Bradley Morgan Haskett
- G02 - OPTICS
Information Patent Application
Stress relieved flat frame for DMD window
- Publication number 20030210452
- Publication date Nov 13, 2003
- Texas Instruments, Inc.
- Bradley Morgan Haskett
- G02 - OPTICS
Information Patent Application
System and method for measuring air flow at multiple points of an a...
- Publication number 20030041675
- Publication date Mar 6, 2003
- Frank O. Armstrong
- G01 - MEASURING TESTING

Frank Armstrong

Person

Patents Grantslast 30 patents

Device with dummy metallic traces

Singulation of wafer level packaging

Singulation of wafer level packaging

Thermal conduction by encapsulation

Stress relieved flat frame for DMD window

Stress relieved frame

System and method for measuring air flow at multiple points of an a...

Methods and systems for shielding in sputtering chambers

Patents Applicationslast 30 patents

PLANAR SURFACES ON SUBSTRATES

SINGULATION OF WAFER LEVEL PACKAGING

THERMAL CONDUCTION BY ENCAPSULATION

Stress relieved flat frame for DMD window

Stress relieved flat frame for DMD window

System and method for measuring air flow at multiple points of an a...