Frank D. Tamweber

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Poughkeepsie, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Shallow trench isolation recess repair using spacer formation process
- Patent number 8,765,491
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Ming Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subground rule STI fill for hot structure
- Patent number 7,393,738
- Issue date Jul 1, 2008
- International Business Machines Corporation
- Byeong Y Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBGROUND RULE STI FILL FOR HOT STRUCTURE
- Publication number 20080224255
- Publication date Sep 18, 2008
- International Business Machines Corporation
- Byeong Y. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBGROUND RULE STI FILL FOR HOT STRUCTURE
- Publication number 20080169528
- Publication date Jul 17, 2008
- International Business Machines Corporation
- Byeong Y. Kim
- H01 - BASIC ELECTRIC ELEMENTS