Frank Daeche

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor system having an inductor module attached to a...
- Patent number 11,996,771
- Issue date May 28, 2024
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic assembly having a laminate inlay and method of pro...
- Patent number 11,903,132
- Issue date Feb 13, 2024
- Infineon Technologies AG
- Petteri Palm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module for PCB embedding, power electronic asse...
- Patent number 11,699,640
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic assembly and method of producing thereof
- Patent number 11,632,860
- Issue date Apr 18, 2023
- Infineon Technologies AG
- Petteri Palm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor package, semiconductor packa...
- Patent number 11,562,967
- Issue date Jan 24, 2023
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a power semiconductor system
- Patent number 11,539,291
- Issue date Dec 27, 2022
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, laminated semiconductor arrangement and...
- Patent number 11,183,445
- Issue date Nov 23, 2021
- Infineon Technologies AG
- Dirk Ahlers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly and method of manufacturing thereof
- Patent number 11,004,823
- Issue date May 11, 2021
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing inductor modules and power semiconductor s...
- Patent number 10,833,583
- Issue date Nov 10, 2020
- Infineon Technologies Austria AG
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor systems having inductor modules, and methods of...
- Patent number 10,601,314
- Issue date Mar 24, 2020
- Infineon Technologies Austria AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 10,325,834
- Issue date Jun 18, 2019
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a passive component formed in a redi...
- Patent number 10,186,481
- Issue date Jan 22, 2019
- Infineon Technologies AG
- Maciej Wojnowski
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 9,773,719
- Issue date Sep 26, 2017
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for manufacturing the same
- Patent number 9,437,548
- Issue date Sep 6, 2016
- Infineon Technologies Austria AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and a method for manufacturing an integr...
- Patent number 9,425,116
- Issue date Aug 23, 2016
- Infineon Technologies AG
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package and packaging methods
- Patent number 9,269,685
- Issue date Feb 23, 2016
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and packaging methods
- Patent number 9,236,362
- Issue date Jan 12, 2016
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and packaging methods
- Patent number 9,105,562
- Issue date Aug 11, 2015
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for manufacturing the same
- Patent number 9,059,155
- Issue date Jun 16, 2015
- Infineon Technologies Austria AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die arrangement and method of forming a die arrangement
- Patent number 8,686,569
- Issue date Apr 1, 2014
- Infineon Technologies AG
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with cavity and a method for producing the same
- Patent number 7,268,436
- Issue date Sep 11, 2007
- Infineon Technologies AG
- Robert Aigner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit carrier, panel, electronic device, and method fo...
- Patent number 7,221,048
- Issue date May 22, 2007
- Infineon Technologies AG
- Frank Daeche
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having a plastic housing and components of a heig...
- Patent number 7,031,170
- Issue date Apr 18, 2006
- Infineon Technologies AG
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a housing for a chip with a micromechanica...
- Patent number 7,011,986
- Issue date Mar 14, 2006
- Infineon Technologies AG
- Frank Daeche
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...
- Publication number 20230282553
- Publication date Sep 7, 2023
- INFINEON TECHNOLOGIES AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC ASSEMBLY HAVING A LAMINATE INLAY AND METHOD OF PRO...
- Publication number 20230240012
- Publication date Jul 27, 2023
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...
- Publication number 20230127874
- Publication date Apr 27, 2023
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE FOR PCB EMBEDDING, POWER ELECTRONIC ASSE...
- Publication number 20220406692
- Publication date Dec 22, 2022
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...
- Publication number 20210313273
- Publication date Oct 7, 2021
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Electronic Assembly and Method of Producing Thereof
- Publication number 20210127490
- Publication date Apr 29, 2021
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF PRODUCING INDUCTOR MODULES AND POWER SEMICONDUCTOR SYSTE...
- Publication number 20210036610
- Publication date Feb 4, 2021
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR ARRANGEMENT, LAMINATED SEMICONDUCTOR ARRANGEMENT AND...
- Publication number 20200279799
- Publication date Sep 3, 2020
- INFINEON TECHNOLOGIES AG
- Dirk AHLERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Manufacturing Inductor Modules and Power Semiconductor S...
- Publication number 20200212798
- Publication date Jul 2, 2020
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Assembly and Method of Manufacturing Thereof
- Publication number 20200035645
- Publication date Jan 30, 2020
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Systems Having Inductor Modules, and Methods of...
- Publication number 20190081562
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Packages and Methods of Fabrication Thereof
- Publication number 20170365539
- Publication date Dec 21, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PASSIVE COMPONENT FORMED IN A REDI...
- Publication number 20170271260
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Maciej Wojnowski
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150279783
- Publication date Oct 1, 2015
- Infineon Technologies Austria AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140264790
- Publication date Sep 18, 2014
- Infineon Technologies Austria AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semicondutor Packages and Methods of Fabrication Thereof
- Publication number 20140145319
- Publication date May 29, 2014
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND A METHOD FOR MANUFACTURING AN INTEGR...
- Publication number 20130082386
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Embedded Chip Package
- Publication number 20120299150
- Publication date Nov 29, 2012
- PRIMARION, INC.
- Benjamin Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND PACKAGING METHODS
- Publication number 20120286413
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT
- Publication number 20120146201
- Publication date Jun 14, 2012
- INFINEON TECHNOLOGIES AG
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer circuit carrier, panel, electronic device, and method fo...
- Publication number 20050151246
- Publication date Jul 14, 2005
- Frank Daeche
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a housing for a chip with a micromechanica...
- Publication number 20050106785
- Publication date May 19, 2005
- Frank Daeche
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic device with cavity and a method for producing the same
- Publication number 20040201090
- Publication date Oct 14, 2004
- Robert Aigner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic device having a plastic housing and components of a heig...
- Publication number 20030076666
- Publication date Apr 24, 2003
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with at least two semiconductor chips, and pro...
- Publication number 20030047760
- Publication date Mar 13, 2003
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS

Frank Daeche

Person

Patents Grantslast 30 patents

Power semiconductor system having an inductor module attached to a...

Power electronic assembly having a laminate inlay and method of pro...

Power semiconductor module for PCB embedding, power electronic asse...

Power electronic assembly and method of producing thereof

Method for fabricating a semiconductor package, semiconductor packa...

Method of manufacturing a power semiconductor system

Semiconductor arrangement, laminated semiconductor arrangement and...

Chip assembly and method of manufacturing thereof

Methods of manufacturing inductor modules and power semiconductor s...

Power semiconductor systems having inductor modules, and methods of...

Semiconductor packages and methods of fabrication thereof

Semiconductor device including a passive component formed in a redi...

Semiconductor packages and methods of fabrication thereof

Chip package and method for manufacturing the same

Integrated circuit package and a method for manufacturing an integr...

Integrated circuit package and packaging methods

Integrated circuit package and packaging methods

Integrated circuit package and packaging methods

Chip package and method for manufacturing the same

Die arrangement and method of forming a die arrangement

Electronic device with cavity and a method for producing the same

Multilayer circuit carrier, panel, electronic device, and method fo...

Electronic device having a plastic housing and components of a heig...

Method for manufacturing a housing for a chip with a micromechanica...

Patents Applicationslast 30 patents

POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...

POWER ELECTRONIC ASSEMBLY HAVING A LAMINATE INLAY AND METHOD OF PRO...

POWER SEMICONDUCTOR SYSTEM HAVING AN INDUCTOR MODULE ATTACHED TO A...

POWER SEMICONDUCTOR MODULE FOR PCB EMBEDDING, POWER ELECTRONIC ASSE...

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKA...

Power Electronic Assembly and Method of Producing Thereof

METHODS OF PRODUCING INDUCTOR MODULES AND POWER SEMICONDUCTOR SYSTE...

SEMICONDUCTOR ARRANGEMENT, LAMINATED SEMICONDUCTOR ARRANGEMENT AND...

Methods of Manufacturing Inductor Modules and Power Semiconductor S...

Chip Assembly and Method of Manufacturing Thereof

Power Semiconductor Systems Having Inductor Modules, and Methods of...

Semiconductor Packages and Methods of Fabrication Thereof

SEMICONDUCTOR DEVICE INCLUDING A PASSIVE COMPONENT FORMED IN A REDI...

CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semicondutor Packages and Methods of Fabrication Thereof

INTEGRATED CIRCUIT PACKAGE AND A METHOD FOR MANUFACTURING AN INTEGR...

Power Semiconductor Module with Embedded Chip Package

INTEGRATED CIRCUIT PACKAGE AND PACKAGING METHODS

DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT

Multilayer circuit carrier, panel, electronic device, and method fo...

Method for manufacturing a housing for a chip with a micromechanica...

Electronic device with cavity and a method for producing the same

Electronic device having a plastic housing and components of a heig...

Electronic component with at least two semiconductor chips, and pro...