Frank Hsu

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New Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
High-density connecting device
- Patent number 11,424,566
- Issue date Aug 23, 2022
- Nextronics Engineering Corp.
- Yen-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector with direct locking and rotational pre-ejection function
- Patent number 11,196,218
- Issue date Dec 7, 2021
- Nextronics Engineering Corp.
- Hou-An Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-DENSITY CONNECTING DEVICE
- Publication number 20220231440
- Publication date Jul 21, 2022
- NEXTRONICS ENGINEERING CORP.
- YEN-CHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS