Frank Juskey

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Apoka, FL, US

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Patents Grantslast 30 patents

Information Patent Grant
Low pressure encapsulant for size-reduced semiconductor package
- Patent number 9,646,857
- Issue date May 9, 2017
- Qorvo US, Inc.
- Howard Terry Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin flip-chip packaging techniques and configurations
- Patent number 9,269,887
- Issue date Feb 23, 2016
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with embedded passive components and method of...
- Patent number 8,680,683
- Issue date Mar 25, 2014
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet-molded chip-scale package
- Patent number 8,487,435
- Issue date Jul 16, 2013
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless package
- Patent number 8,030,770
- Issue date Oct 4, 2011
- TriQuint Semiconductor, Inc.
- Frank Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with included passive devices
- Patent number 7,489,021
- Issue date Feb 10, 2009
- Advanced Interconnect Technologies Limited
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin multiple semiconductor die package
- Patent number 7,247,933
- Issue date Jul 24, 2007
- Advanced Interconnect Technologies Limited
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE ENCAPSULANT FOR SIZE-REDUCED SEMICONDUCTOR PACKAGE
- Publication number 20170047232
- Publication date Feb 16, 2017
- Qorvo US, Inc.
- Howard Terry Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS
- Publication number 20140106511
- Publication date Apr 17, 2014
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS
- Publication number 20130234344
- Publication date Sep 12, 2013
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET-MOLDED CHIP-SCALE PACKAGE
- Publication number 20120080768
- Publication date Apr 5, 2012
- TriQuint Semiconductor, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame with Included Passive Devices
- Publication number 20080036034
- Publication date Feb 14, 2008
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin multiple semiconductor die package
- Publication number 20060231937
- Publication date Oct 19, 2006
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS