Frank Lei Ding

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Milpitas, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Chip on carrier
- Patent number 11,418,003
- Issue date Aug 16, 2022
- II-VI DELAWARE, INC.
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal flex circuit with resistance weldable cover
- Patent number 10,816,739
- Issue date Oct 27, 2020
- II-VI Delaware Inc.
- Frank Lei Ding
- G02 - OPTICS
Information Patent Grant
Chip on carrier
- Patent number 10,374,386
- Issue date Aug 6, 2019
- Finisar Corporation
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assemblies for optoelectronic modules
- Patent number 10,036,861
- Issue date Jul 31, 2018
- Finisar Corporation
- Frank Lei Ding
- G02 - OPTICS
Information Patent Grant
Small packaged tunable laser transmitter
- Patent number 9,246,595
- Issue date Jan 26, 2016
- NeoPhotonics Corporation
- Andrew John Daiber
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Laser assembly and method for manufacturing the same
- Patent number 8,908,727
- Issue date Dec 9, 2014
- Emcore Corporation
- Yinan Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HORIZONTAL FLEX CIRCUIT WITH RESISTANCE WELDABLE COVER
- Publication number 20200116961
- Publication date Apr 16, 2020
- Finisar Corporation
- Frank Lei Ding
- G02 - OPTICS
Information Patent Application
CHIP ON CARRIER
- Publication number 20190379176
- Publication date Dec 12, 2019
- Finisar Corporation
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL PACKAGED TUNABLE LASER TRANSMITTER
- Publication number 20160142147
- Publication date May 19, 2016
- NEOPHOTONICS CORPORATION
- Andrew John Daiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL PACKAGED TUNABLE LASER TRANSMITTER
- Publication number 20150162990
- Publication date Jun 11, 2015
- EMCORE CORPORATION
- Andrew John Daiber
- H01 - BASIC ELECTRIC ELEMENTS