FranK R. Deweese

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McMinnville, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Compact package assembly and methods for the same
- Patent number 10,197,624
- Issue date Feb 5, 2019
- Intel Corporation
- Pritulkumar Shah
- G01 - MEASURING TESTING
Information Patent Grant
Hybrid compression socket connector for integrated circuits
- Patent number 7,177,142
- Issue date Feb 13, 2007
- Intel Corporation
- Ashok N. Kabadi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPACT PACKAGE ASSEMBLY AND METHODS FOR THE SAME
- Publication number 20170181284
- Publication date Jun 22, 2017
- Pritulkumar Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid compression socket connector for integrated circuits
- Publication number 20060067041
- Publication date Mar 30, 2006
- Ashok N. Kabadi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE DENSITY GRAPHITE FOAM HEAT SINK
- Publication number 20050088823
- Publication date Apr 28, 2005
- Ashok N. Kabadi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES