Frank S. d'Aragona

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive diffusion barrier of titanium nitride in ohmic contact w...
- Patent number 5,369,304
- Issue date Nov 29, 1994
- Motorola, Inc.
- Israel A. Lesk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical current flow semiconductor device utilizing wafer bonding
- Patent number 5,323,059
- Issue date Jun 21, 1994
- Motorola, Inc.
- Robert E. Rutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated method for joining wafers
- Patent number 5,314,107
- Issue date May 24, 1994
- Motorola, Inc.
- Frank S. d'Aragona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making dielectric and conductive isolated island
- Patent number 5,268,326
- Issue date Dec 7, 1993
- Motorola, Inc.
- Israel A. Lesk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon film with improved thickness control
- Patent number 5,256,581
- Issue date Oct 26, 1993
- Motorola, Inc.
- Juergen A. Foerstner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical current flow semiconductor device utilizing wafer bonding
- Patent number 5,183,769
- Issue date Feb 2, 1993
- Motorola, Inc.
- Robert E. Rutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low voltage, deep junction device and method
- Patent number 5,141,887
- Issue date Aug 25, 1992
- Motorola, Inc.
- Hang M. Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gradient chuck method for wafer bonding employing a convex pressure
- Patent number 5,131,968
- Issue date Jul 21, 1992
- Motorola, Inc.
- Raymond C. Wells
- B32 - LAYERED PRODUCTS
Information Patent Grant
Monocrystalline semiconductor buried layers for electrical contacts...
- Patent number 4,849,371
- Issue date Jul 18, 1989
- Motorola Inc.
- Kent W. Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a void free wafer via vacuum lamination
- Patent number 4,818,323
- Issue date Apr 4, 1989
- Motorola Inc.
- Frank S. d'Aragona
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Frank S. d'Aragona

Person

Patents Grantslast 30 patents

Conductive diffusion barrier of titanium nitride in ohmic contact w...

Vertical current flow semiconductor device utilizing wafer bonding

Automated method for joining wafers

Method of making dielectric and conductive isolated island

Silicon film with improved thickness control

Vertical current flow semiconductor device utilizing wafer bonding

Low voltage, deep junction device and method

Gradient chuck method for wafer bonding employing a convex pressure

Monocrystalline semiconductor buried layers for electrical contacts...

Method of making a void free wafer via vacuum lamination