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Frank Secco d'Aragona
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Scottsdale, AZ, US
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last 30 patents
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Patent Grant
Gradient chuck method for wafer bonding employing a convex pressure
Patent number
RE36890
Issue date
Oct 3, 2000
Motorola, Inc.
Raymond C. Wells
156 - Adhesive bonding and miscellaneous chemical manufacture
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Patent Grant
Method of bonding a semiconductor wafer
Patent number
6,113,721
Issue date
Sep 5, 2000
Motorola, Inc.
Frank T. Secco d'Aragona
B24 - GRINDING POLISHING
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Patent Grant
Method of forming a conductive diffusion barrier
Patent number
5,567,649
Issue date
Oct 22, 1996
Motorola Inc.
Israel A. Lesk
H01 - BASIC ELECTRIC ELEMENTS