Frank Secco d'Aragona

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Scottsdale, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Gradient chuck method for wafer bonding employing a convex pressure
- Patent number RE36890
- Issue date Oct 3, 2000
- Motorola, Inc.
- Raymond C. Wells
- 156 - Adhesive bonding and miscellaneous chemical manufacture
Information Patent Grant
Method of bonding a semiconductor wafer
- Patent number 6,113,721
- Issue date Sep 5, 2000
- Motorola, Inc.
- Frank T. Secco d'Aragona
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming a conductive diffusion barrier
- Patent number 5,567,649
- Issue date Oct 22, 1996
- Motorola Inc.
- Israel A. Lesk
- H01 - BASIC ELECTRIC ELEMENTS