Frank St. John

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Rockford, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Heat-Shrinkable EMI/RFI shielding material
- Patent number 6,881,904
- Issue date Apr 19, 2005
- Methode Electronics, Inc.
- Emil Millas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board conductive via hole filler having metal oxide...
- Patent number 6,692,664
- Issue date Feb 17, 2004
- Methode Electronics, Inc.
- Frank St. John
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board conductive via hole filler having metal oxide...
- Patent number 6,337,037
- Issue date Jan 8, 2002
- Methode Electronics Inc.
- Frank St. John
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming plugs in vias of a circuit board by utilizing a p...
- Patent number 5,761,803
- Issue date Jun 9, 1998
- Frank St. John
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method of making heat-shrinkable EMI/RFI shielding material
- Publication number 20050202158
- Publication date Sep 15, 2005
- Emil Millas
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
Adhesive interconnector
- Publication number 20040077189
- Publication date Apr 22, 2004
- Frank St. John
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-shrinkable EMI/RFI shielding material
- Publication number 20030186602
- Publication date Oct 2, 2003
- Emil Millas
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...