Frank Stepniak

Person

Noblesville, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
No-flow underfill process and material therefor
- Patent number 6,943,058
- Issue date Sep 13, 2005
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wafer-applied underfill process
- Patent number 6,916,684
- Issue date Jul 12, 2005
- Delphi Technologies, Inc.
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip interconnected with increased current-carrying capability
- Patent number 6,822,327
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- Pankaj Mithal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-based solder alloys containing copper
- Patent number 6,811,892
- Issue date Nov 2, 2004
- Delphi Technologies, Inc.
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive material with metallurgically-bonded conductive...
- Patent number 6,802,446
- Issue date Oct 12, 2004
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface bumping method and structure formed thereby
- Patent number 6,375,062
- Issue date Apr 23, 2002
- Delphi Technologies, Inc.
- William D. Higdon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of solder bumping a circuit component
- Patent number 6,281,106
- Issue date Aug 28, 2001
- Delphi Technologies, Inc.
- William David Higdon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit with low-stress under-bump metallurgy
- Publication number 20070029669
- Publication date Feb 8, 2007
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip interconnect with increased current-carrying capability
- Publication number 20050046024
- Publication date Mar 3, 2005
- DELPHI TECHNOLOGIES, INC.
- Pankaj Mithal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP INTERCONNECT WITH INCREASED CURRENT-CARRYING CAPABILITY
- Publication number 20040251542
- Publication date Dec 16, 2004
- Pankaj Mithal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No-flow underfill process and material therefor
- Publication number 20040185602
- Publication date Sep 23, 2004
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wafer-applied underfill process
- Publication number 20040185601
- Publication date Sep 23, 2004
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-based solder alloys containing copper
- Publication number 20040035909
- Publication date Feb 26, 2004
- Shing Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive material with metallurgically-bonded conductive...
- Publication number 20030146266
- Publication date Aug 7, 2003
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Frank Stepniak

Person

Patents Grantslast 30 patents

No-flow underfill process and material therefor

Wafer-applied underfill process

Flip-chip interconnected with increased current-carrying capability

Lead-based solder alloys containing copper

Conductive adhesive material with metallurgically-bonded conductive...

Surface bumping method and structure formed thereby

Method of solder bumping a circuit component

Patents Applicationslast 30 patents

Integrated circuit with low-stress under-bump metallurgy

Flip-chip interconnect with increased current-carrying capability

FLIP-CHIP INTERCONNECT WITH INCREASED CURRENT-CARRYING CAPABILITY

No-flow underfill process and material therefor

Wafer-applied underfill process

Lead-based solder alloys containing copper

Conductive adhesive material with metallurgically-bonded conductive...