Frank W. Kulesza

Person

Winchester, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming electrically conductive polymer interconnects on...
- Patent number 6,138,348
- Issue date Oct 31, 2000
- Polymer Flip Chip Corporation
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrically conductive polymer interconnects on...
- Patent number 5,918,364
- Issue date Jul 6, 1999
- Polymer Flip Chip Corporation
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming electrically conductive polymer interconnects on...
- Patent number 5,879,761
- Issue date Mar 9, 1999
- Polymer Flip Chip Corporation
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrically conductive polymer interconnects on...
- Patent number 5,611,140
- Issue date Mar 18, 1997
- Epoxy Technology, Inc.
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip technology using electrically conductive polymers and die...
- Patent number 5,237,130
- Issue date Aug 17, 1993
- Epoxy Technology, Inc.
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonding method using electrically conductive polymer bumps
- Patent number 5,196,371
- Issue date Mar 23, 1993
- Epoxy Technology, Inc.
- Frank W. Kulesza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip technology using electrically conductive polymers and die...
- Patent number 5,074,947
- Issue date Dec 24, 1991
- Epoxy Technology, Inc.
- Richard H. Estes
- H01 - BASIC ELECTRIC ELEMENTS

Frank W. Kulesza

Person

Patents Grantslast 30 patents

Method of forming electrically conductive polymer interconnects on...

Method of forming electrically conductive polymer interconnects on...

Method for forming electrically conductive polymer interconnects on...

Method of forming electrically conductive polymer interconnects on...

Flip chip technology using electrically conductive polymers and die...

Flip chip bonding method using electrically conductive polymer bumps

Flip chip technology using electrically conductive polymers and die...