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Frank Wei

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Device chip manufacturing method
    • Patent number 11,469,142
    • Issue date Oct 11, 2022
    • Disco Corporation
    • Frank Wei
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Manufacturing method for wiring board
    • Patent number 10,874,021
    • Issue date Dec 22, 2020
    • Disco Corporation
    • Ye Chen
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Semiconductor wafer processing method
    • Patent number 10,796,962
    • Issue date Oct 6, 2020
    • Disco Corporation
    • Masatoshi Wakahara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processing system
    • Patent number 10,189,182
    • Issue date Jan 29, 2019
    • Disco Corporation
    • Masahiro Takekawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Workpiece processing method
    • Patent number 9,576,835
    • Issue date Feb 21, 2017
    • Disco Corporation
    • Frank Wei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processing method for plate-shaped workpiece
    • Patent number 9,446,479
    • Issue date Sep 20, 2016
    • Disco Corporation
    • Frank Wei
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    DEVICE CHIP MANUFACTURING METHOD
    • Publication number 20200343139
    • Publication date Oct 29, 2020
    • Disco Corporation
    • Frank Wei
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    SEMICONDUCTOR WAFER PROCESSING METHOD
    • Publication number 20200020585
    • Publication date Jan 16, 2020
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20180330957
    • Publication date Nov 15, 2018
    • Disco Corporation
    • Frank Wei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD FOR WIRING BOARD
    • Publication number 20180103547
    • Publication date Apr 12, 2018
    • Disco Corporation
    • Ye Chen
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PROCESSING SYSTEM
    • Publication number 20160346956
    • Publication date Dec 1, 2016
    • Disco Corporation
    • Masahiro Takekawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WORKPIECE PROCESSING METHOD
    • Publication number 20150136312
    • Publication date May 21, 2015
    • Disco Corporation
    • Frank Wei
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    PROCESSING METHOD FOR PLATE-SHAPED WORKPIECE
    • Publication number 20140305916
    • Publication date Oct 16, 2014
    • Disco Corporation
    • Frank Wei
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR