Frank Winter

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,847,274
- Issue date Dec 19, 2017
- Infineon Technologies AG
- Frank Winter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,589,922
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, chip arrangement, and method for manufacturing the same
- Patent number 9,585,241
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,532,459
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Frank Winter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module with cooling structure on bonding substrate for coolin...
- Patent number 9,275,926
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20170154835
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20170092563
- Publication date Mar 30, 2017
- INFINEON TECHNOLOGIES AG
- Frank WINTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20150264796
- Publication date Sep 17, 2015
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150085446
- Publication date Mar 26, 2015
- INFINEON TECHNOLOGIES AG
- Wolfram Hable
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20150043169
- Publication date Feb 12, 2015
- INFINEON TECHNOLOGIES AG
- Frank WINTER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power module comprising two substrates and method of manufacturing...
- Publication number 20140353818
- Publication date Dec 4, 2014
- Ottmar GEITNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module with cooling structure on bonding substrate for coolin...
- Publication number 20140327127
- Publication date Nov 6, 2014
- Wolfram HABLE
- H01 - BASIC ELECTRIC ELEMENTS

Frank Winter

Person

Patents Grantslast 30 patents

Power module comprising two substrates and method of manufacturing...

Electronic module and method of manufacturing the same

Electronic module and method of manufacturing the same

Substrate, chip arrangement, and method for manufacturing the same

Electronic module and method of manufacturing the same

Power module with cooling structure on bonding substrate for coolin...

Patents Applicationslast 30 patents

Electronic module and method of manufacturing the same

Electronic module and method of manufacturing the same

Electronic module and method of manufacturing the same

SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME

Electronic module and method of manufacturing the same

Power module comprising two substrates and method of manufacturing...

Power module with cooling structure on bonding substrate for coolin...