Frank Wu

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Koahsiung Hsien, TW

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Patents Applicationslast 30 patents

Information Patent Application
Thermally enhanced cavity down ball grid array package
- Publication number 20070040269
- Publication date Feb 22, 2007
- Taiwan Semiconductor Manufacturing Co., LTD
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional package and packaging method for integrated circuits
- Publication number 20060065958
- Publication date Mar 30, 2006
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS