François Leverd

Person

Cesson, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Etching method
- Patent number 11,469,095
- Issue date Oct 11, 2022
- STMicroelectronics (Crolles 2) SAS
- Delia Ristoiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching a cavity in a stack of layers
- Patent number 10,770,306
- Issue date Sep 8, 2020
- STMicroelectronics (Crolles 2) SAS
- Pierre Bar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a backside-illuminated imaging device and c...
- Patent number 8,847,344
- Issue date Sep 30, 2014
- STMicroelectronics (Croles 2) SAS
- Francois Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a deep trench in a microelectronic component s...
- Patent number 8,796,148
- Issue date Aug 5, 2014
- STMicroelectronics (Crolles 2) SAS
- François Leverd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a back-side illuminated image sensor
- Patent number 8,436,440
- Issue date May 7, 2013
- STMicroelectronics (Crolles 2) SAS
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a strongly-conductive buried layer in a semicond...
- Patent number 7,456,071
- Issue date Nov 25, 2008
- STMicroelectronics S.A.
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic components and method of fabricating the same
- Patent number 7,214,597
- Issue date May 8, 2007
- STMicroelectronics S.A.
- Philippe Coronel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolating trench and manufacturing process
- Patent number 6,828,646
- Issue date Dec 7, 2004
- STMicroelectronics S.A.
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM memory integration method
- Patent number 6,759,304
- Issue date Jul 6, 2004
- STMicroelectronics S.A.
- Philippe Coronel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production process for the local interconnection level u...
- Patent number 6,689,655
- Issue date Feb 10, 2004
- STMicroelectronics S.A.
- Philippe Coronel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming deep and shallow insulative regions of an integ...
- Patent number 6,653,182
- Issue date Nov 25, 2003
- STMicroelectronics S.A.
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a BSG layer
- Patent number 6,344,422
- Issue date Feb 5, 2002
- International Business Machines Corporation
- Bruno Borgognoni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for buried plate formation in deep trench capacitors
- Patent number 6,281,068
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Philippe Coronel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD
- Publication number 20230005735
- Publication date Jan 5, 2023
- STMicroelectronics (Crolles 2) SAS
- Delia RISTOIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20200211835
- Publication date Jul 2, 2020
- STMicroelectronics (Crolles 2) SAS
- Delia RISTOIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ETCHING A CAVITY IN A STACK OF LAYERS
- Publication number 20190214270
- Publication date Jul 11, 2019
- STMicroelectronics (Crolles 2) SAS
- Pierre BAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A DEEP TRENCH IN A MICROELECTRONIC COMPONENT SUB...
- Publication number 20130154051
- Publication date Jun 20, 2013
- STMICROELECTRONICS (CROLLES 2) SAS
- Arnaud Tournier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A DEEP TRENCH IN A MICROELECTRONIC COMPONENT S...
- Publication number 20130052829
- Publication date Feb 28, 2013
- STMicroelectronics (Crolles 2) SAS
- Francois Leverd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING A BACKSIDE-ILLUMINATED IMAGING DEVICE AND C...
- Publication number 20120306035
- Publication date Dec 6, 2012
- STMICROELECTRONICS (CROLLES 2) SAS
- Francois Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A BACK-SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20110108939
- Publication date May 12, 2011
- STMicroelectronics (Crolles 2) SAS
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with a strongly-conductive buried layer
- Publication number 20050191818
- Publication date Sep 1, 2005
- STMicroelectronics, S.A.
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried connections in an integrated circuit substrate
- Publication number 20040145058
- Publication date Jul 29, 2004
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with a strongly-conductive buried layer
- Publication number 20040104448
- Publication date Jun 3, 2004
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic components and method of fabricating the same
- Publication number 20040033676
- Publication date Feb 19, 2004
- STMicroelectronics S.A.
- Philippe Coronel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolating trench and manufacturing process
- Publication number 20030098493
- Publication date May 29, 2003
- STMicroelectronics S.A.
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production process for the local interconnection level using a diel...
- Publication number 20020142519
- Publication date Oct 3, 2002
- STMicroelectronics S.A.
- Philippe Coronel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dram memory integration method
- Publication number 20020110976
- Publication date Aug 15, 2002
- STMicroelectronics S.A.
- Philippe Coronel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming deep and shallow insulative regions of an integ...
- Publication number 20020014676
- Publication date Feb 7, 2002
- STMicroelectronics S.A.
- Michel Marty
- H01 - BASIC ELECTRIC ELEMENTS

François Leverd

Person

Patents Grantslast 30 patents

Etching method

Method of etching a cavity in a stack of layers

Process for fabricating a backside-illuminated imaging device and c...

Method for producing a deep trench in a microelectronic component s...

Method for forming a back-side illuminated image sensor

Method for forming a strongly-conductive buried layer in a semicond...

Electronic components and method of fabricating the same

Isolating trench and manufacturing process

DRAM memory integration method

Method for production process for the local interconnection level u...

Process for forming deep and shallow insulative regions of an integ...

Method of depositing a BSG layer

Method for buried plate formation in deep trench capacitors

Patents Applicationslast 30 patents

ETCHING METHOD

ETCHING METHOD

METHOD OF ETCHING A CAVITY IN A STACK OF LAYERS

METHOD FOR FORMING A DEEP TRENCH IN A MICROELECTRONIC COMPONENT SUB...

METHOD FOR PRODUCING A DEEP TRENCH IN A MICROELECTRONIC COMPONENT S...

PROCESS FOR FABRICATING A BACKSIDE-ILLUMINATED IMAGING DEVICE AND C...

METHOD FOR FORMING A BACK-SIDE ILLUMINATED IMAGE SENSOR

Integrated circuit with a strongly-conductive buried layer

Buried connections in an integrated circuit substrate

Integrated circuit with a strongly-conductive buried layer

Electronic components and method of fabricating the same

Isolating trench and manufacturing process

Production process for the local interconnection level using a diel...

Dram memory integration method

Process for forming deep and shallow insulative regions of an integ...