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Franz Gabler
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Lappersdorf, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Transducer package with integrated sealing
Patent number
10,519,030
Issue date
Dec 31, 2019
Infineon Technologies AG
Klaus Elian
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Molded chip package and method of manufacturing the same
Patent number
9,780,061
Issue date
Oct 3, 2017
Infineon Technologies AG
Franz Gabler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of processing a substrate and a method of processing a wafer
Patent number
9,548,248
Issue date
Jan 17, 2017
Infineon Technologies AG
Frank Pueschner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of electrically isolating shared leads of a lead frame strip
Patent number
9,324,642
Issue date
Apr 26, 2016
Infineon Technologies AG
Frank Püschner
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Transducer package with integrated sealing
Publication number
20170283246
Publication date
Oct 5, 2017
INFINEON TECHNOLOGIES AG
Klaus ELIAN
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD OF PROCESSING A SUBSTRATE AND A METHOD OF PROCESSING A WAFER
Publication number
20160042998
Publication date
Feb 11, 2016
INFINEON TECHNOLOGIES AG
Frank Pueschner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded chip package and method of manufacturing the same
Publication number
20150340307
Publication date
Nov 26, 2015
INFINEON TECHNOLOGIES AG
Franz GABLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Electrically Isolating Shared Leads of a Lead Frame Strip
Publication number
20150130037
Publication date
May 14, 2015
INFINEON TECHNOLOGIES AG
Frank Püschner
H01 - BASIC ELECTRIC ELEMENTS