Franz Hecht

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Bernhardswald, DE

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for connecting two wafers in a planar manner for...
- Patent number 6,972,069
- Issue date Dec 6, 2005
- Infineon Technologies AG
- Franz Hecht
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Device for connecting two wafers in a planar manner for grinding do...
- Publication number 20060032587
- Publication date Feb 16, 2006
- Infineon Technolgies AG
- Franz Hecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and method for connecting two wafers in a planar manner for...
- Publication number 20030173017
- Publication date Sep 18, 2003
- Franz Hecht
- H01 - BASIC ELECTRIC ELEMENTS