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Patents Grantslast 30 patents

Information Patent Grant
Adhesive mixture suitable for mounting and demounting a semiconduct...
- Patent number 6,171,385
- Issue date Jan 9, 2001
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Robert Rurlaender
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for polishing semiconductor wafers
- Patent number 5,980,361
- Issue date Nov 9, 1999
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Paul Muller
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR TREATING A POLISHED SEMICONDUCTOR WATER IMMEDIATELY AFT...
- Publication number 20020187639
- Publication date Dec 12, 2002
- HEINRICH HENNHOFER
- H01 - BASIC ELECTRIC ELEMENTS