Franz-Peter Kalz

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Package with component connected with carrier via spacer particles
- Patent number 11,094,619
- Issue date Aug 17, 2021
- Infineon Technologies AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,858,245
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor device and method for fabricating the same
- Patent number 10,818,805
- Issue date Oct 27, 2020
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package with component connected with carrier via spacer particles
- Patent number 10,438,878
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,370,244
- Issue date Aug 6, 2019
- Infineon Technologies AG
- Florian Brandl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 10,304,795
- Issue date May 28, 2019
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip arrangement including a ceramic layer
- Patent number 9,984,897
- Issue date May 29, 2018
- Infineon Technologies AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical semiconductor sensing device
- Patent number 9,790,086
- Issue date Oct 17, 2017
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including antistatic die attach material
- Patent number 9,741,677
- Issue date Aug 22, 2017
- Infineon Technologies AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device and method
- Patent number 9,728,652
- Issue date Aug 8, 2017
- Infineon Technologies AG
- Klaus Elian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical semiconductor sensing device
- Patent number 9,567,211
- Issue date Feb 14, 2017
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component
- Patent number 9,559,078
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and chip assembly
- Patent number 9,530,754
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrophoretically depositing a film on an electronic a...
- Patent number 9,313,897
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a chip package, chip package, method of man...
- Patent number 9,159,701
- Issue date Oct 13, 2015
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including two power semiconductor chips and manufacturing th...
- Patent number 9,048,338
- Issue date Jun 2, 2015
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical semiconductor sensing device
- Patent number 9,021,887
- Issue date May 5, 2015
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component
- Patent number 8,947,886
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching a metal surface to a carrier, a method for att...
- Patent number 8,912,450
- Issue date Dec 16, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, method for producing a chip and device for laser ablation
- Patent number 8,564,026
- Issue date Oct 22, 2013
- Infineon Technologies AG
- Franz-Peter Kalz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH COMPONENT CONNECTED WITH CARRIER VIA SPACER PARTICLES
- Publication number 20200043836
- Publication date Feb 6, 2020
- INFINEON TECHNOLOGIES AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...
- Publication number 20190300362
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...
- Publication number 20190161345
- Publication date May 30, 2019
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Sensor Device and Method for Fabricating the Same
- Publication number 20190148566
- Publication date May 16, 2019
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH COMPONENT CONNECTED WITH CARRIER VIA SPACER PARTICLES
- Publication number 20180294210
- Publication date Oct 11, 2018
- INFINEON TECHNOLOGIES AG
- Manfred Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL
- Publication number 20170352638
- Publication date Dec 7, 2017
- INFINEON TECHNOLOGIES AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL
- Publication number 20170256515
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Volker Strutz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20170004979
- Publication date Jan 5, 2017
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Semiconductor Sensing Device
- Publication number 20170003180
- Publication date Jan 5, 2017
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Electrophoretically Depositing a Film on an Electronic A...
- Publication number 20160240449
- Publication date Aug 18, 2016
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHIP PACKAGE AND CHIP ASSEMBLY
- Publication number 20160035700
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Semiconductor Sensing Device
- Publication number 20150217994
- Publication date Aug 6, 2015
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic Component
- Publication number 20150111343
- Publication date Apr 23, 2015
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CHIP PACKAGE, CHIP PACKAGE, METHOD OF MAN...
- Publication number 20150076672
- Publication date Mar 19, 2015
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140197527
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...
- Publication number 20140197552
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor with masking
- Publication number 20140116149
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Walter DIEZ
- G01 - MEASURING TESTING
Information Patent Application
Method of Electrophoretic Depositing (EPD) a Film on a System and S...
- Publication number 20140076613
- Publication date Mar 20, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sensor Device and Method
- Publication number 20130187201
- Publication date Jul 25, 2013
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL SEMICONDUCTOR SENSING DEVICE
- Publication number 20130152696
- Publication date Jun 20, 2013
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device Including Two Power Semiconductor Chips and Manufacturing Th...
- Publication number 20130113114
- Publication date May 9, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20130021766
- Publication date Jan 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...
- Publication number 20120327614
- Publication date Dec 27, 2012
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP, METHOD FOR PRODUCING A CHIP AND DEVICE FOR LASER ABLATION
- Publication number 20120074598
- Publication date Mar 29, 2012
- INFINEON TECHNOLOGIES AG
- Franz-Peter Kalz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Franz-Peter Kalz

Person

Patents Grantslast 30 patents

Package with component connected with carrier via spacer particles

Deposition of protective material at wafer level in front end for e...

Semiconductor sensor device and method for fabricating the same

Package with component connected with carrier via spacer particles

Deposition of protective material at wafer level in front end for e...

Semiconductor device including antistatic die attach material

Method for manufacturing a chip arrangement including a ceramic layer

Micromechanical semiconductor sensing device

Semiconductor device including antistatic die attach material

Sensor device and method

Micromechanical semiconductor sensing device

Electronic component

Chip package and chip assembly

Method for electrophoretically depositing a film on an electronic a...

Method of manufacturing a chip package, chip package, method of man...

Device including two power semiconductor chips and manufacturing th...

Micromechanical semiconductor sensing device

Electronic component

Method for attaching a metal surface to a carrier, a method for att...

Chip, method for producing a chip and device for laser ablation

Patents Applicationslast 30 patents

PACKAGE WITH COMPONENT CONNECTED WITH CARRIER VIA SPACER PARTICLES

DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...

DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...

Semiconductor Sensor Device and Method for Fabricating the Same

PACKAGE WITH COMPONENT CONNECTED WITH CARRIER VIA SPACER PARTICLES

SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL

SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

Micromechanical Semiconductor Sensing Device

Method for Electrophoretically Depositing a Film on an Electronic A...

CHIP PACKAGE AND CHIP ASSEMBLY

Micromechanical Semiconductor Sensing Device

Electronic Component

METHOD OF MANUFACTURING A CHIP PACKAGE, CHIP PACKAGE, METHOD OF MAN...

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...

Sensor with masking

Method of Electrophoretic Depositing (EPD) a Film on a System and S...

Sensor Device and Method

MICROMECHANICAL SEMICONDUCTOR SENSING DEVICE

Device Including Two Power Semiconductor Chips and Manufacturing Th...

Electronic Component

METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...

CHIP, METHOD FOR PRODUCING A CHIP AND DEVICE FOR LASER ABLATION