Franz Schilling

Person

Radeberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Laser conditioning of solid bodies using prior knowledge from previ...
- Patent number 11,822,307
- Issue date Nov 21, 2023
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of treating a solid layer bonded to a carrier substrate
- Patent number 11,518,066
- Issue date Dec 6, 2022
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a crack in the edge region of a donor substrate,...
- Patent number 10,994,442
- Issue date May 4, 2021
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the material-saving production of wafers and processing...
- Patent number 10,843,380
- Issue date Nov 24, 2020
- Siltectra GmbH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for guiding a crack in the peripheral region of a donor subs...
- Patent number 10,676,386
- Issue date Jun 9, 2020
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for guiding a crack in the peripheral region of a donor subs...
- Patent number 10,280,107
- Issue date May 7, 2019
- Siltectra, GmbH
- Marko Swoboda
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE
- Publication number 20210213643
- Publication date Jul 15, 2021
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Treating a Solid Layer Bonded to a Carrier Substrate
- Publication number 20210039279
- Publication date Feb 11, 2021
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser Conditioning of Solid Bodies Using Prior Knowledge from Previ...
- Publication number 20190302725
- Publication date Oct 3, 2019
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20190218131
- Publication date Jul 18, 2019
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A CRACK IN THE EDGE REGION OF A DONOR SUBSTRATE,...
- Publication number 20180370073
- Publication date Dec 27, 2018
- SILTECTRA GMBH
- Marko Swoboda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR THE MATERIAL-SAVING PRODUCTION OF WAFERS AND PROCESSING...
- Publication number 20180243944
- Publication date Aug 30, 2018
- SILTECTRA GMBH
- Franz Schilling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...
- Publication number 20180185957
- Publication date Jul 5, 2018
- SILTECTRA GMBH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR THE LOW-LOSS PRODUCTION OF MULTI-COMPONENT WAFERS
- Publication number 20180118562
- Publication date May 3, 2018
- SILTECTRA GMBH
- Wolfram Drescher
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Franz Schilling

Person

Patents Grantslast 30 patents

Laser conditioning of solid bodies using prior knowledge from previ...

Method of treating a solid layer bonded to a carrier substrate

Method for forming a crack in the edge region of a donor substrate,...

Method for the material-saving production of wafers and processing...

Method for guiding a crack in the peripheral region of a donor subs...

Method for guiding a crack in the peripheral region of a donor subs...

Patents Applicationslast 30 patents

METHOD FOR FORMING A CRACK IN AN EDGE REGION OF A DONOR SUBSTRATE

Method of Treating a Solid Layer Bonded to a Carrier Substrate

Laser Conditioning of Solid Bodies Using Prior Knowledge from Previ...

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

METHOD FOR FORMING A CRACK IN THE EDGE REGION OF A DONOR SUBSTRATE,...

METHOD FOR THE MATERIAL-SAVING PRODUCTION OF WAFERS AND PROCESSING...

METHOD FOR GUIDING A CRACK IN THE PERIPHERAL REGION OF A DONOR SUBS...

METHOD FOR THE LOW-LOSS PRODUCTION OF MULTI-COMPONENT WAFERS